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OEM FUNCTIONAL SPECIFICATION
ULTRASTAR XP (DFHC) SSA MODELS
1.12/2.25 GB - 1.0" HIGH
4.51 GB - 1.6" HIGH
3.5 FORM FACTOR DISK DRIVE
VERSION 5.0
August 15, 1995
Publication number 3304
IBM Corporation
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OEM FUNCTIONAL SPECIFICATION ULTRASTAR XP (DFHC) SSA MODELS 1.12/2.25 GB - 1.0" HIGH
Preface
This document details the product hardware specification for the Ultrastar XP SSA family of Direct Access
Storage Devices. The capacity model offerings are 1.12, 2.25, and 4.51 GBytes (see 2.1.1, “Capacity
Equations” on page 13 for exact capacities based on model and block size). The form factor offerings are
'Brick On Sled' carrier and 3.5-inch small form factor (refer to 4.1.1, “Weight and Dimensions” on page 51
for exact dimensions).
This document, in conjunction with the Ultrastar XP (DFHC) SSA Models Interface Specification, make
up the Functional Specification for the Ultrastar XP SSA (DFHC) product.
The product description and other data found in this document represent IBM's design objectives and is
provided for information and comparative purposes. Actual results may vary based on a variety of factors
and the information herein is subject to change. THIS PRODUCT DATA DOES NOT CONSTITUTE A
WARRANTY, EXPRESS OR IMPLIED. Questions regarding IBM's warranty terms or the methodology
used to derive the data should be referred to your IBM customer representative.
Note: Not all models described in this document are in plan. Contact your IBM customer representative
for actual product plans.
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Contents
1.0 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1.1 General Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9
9
9
9
9
1.1.2 Performance Summary
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1.3 Interface Controller Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1.4 Reliability Features
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
1.2 Models
2.0 Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.1.1 Capacity Equations
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.2 Power Requirements by Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.2.1 C1x Models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.2.2 C2x Models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
2.2.3 C4x Models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
2.2.4 CxB Models
2.2.5 Power Supply Ripple
2.2.6 Grounding Requirements of the Disk Enclosure . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
2.2.7 Hot plug/unplug support
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
2.2.8 Bring-up Sequence (and Stop) Times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
3.0 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
3.1 Environment Definition
3.2 Workload Definition
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
3.2.1 Sequential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
3.2.2 Random . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
3.3 Command Execution Time
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
3.3.1 Basic Component Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
3.3.2 Comments
3.4 Approximating Performance for Different Environments . . . . . . . . . . . . . . . . . . . . . . . . . 43
3.4.1 For Different Transfer Sizes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
3.4.2 When Read Caching is Enabled
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
3.4.3 When Write Caching is Enabled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
3.4.4 When Adaptive Caching is Enabled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
3.4.5 When Read-ahead is Enabled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
3.4.6 When No Seek is Required . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
3.4.7 For Queued Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
3.4.8 Out of Order Transfers
3.5 Skew
3.5.1 Cylinder to Cylinder Skew
3.5.2 Track to Track Skew
3.6 Idle Time Functions
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
3.6.1 Servo Run Out Measurements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
3.6.2 Servo Bias Measurements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
3.6.3 Predictive Failure Analysis
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
3.6.4 Channel Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
3.6.5 Save Logs and Pointers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
3.6.6 Disk Sweep . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
3.6.7 Summary
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
3.7 Command Timeout Limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
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4.0 Mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
4.1 Small Form Factor Models (CxC)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
4.1.1 Weight and Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
4.1.2 Clearances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
4.1.3 Mounting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
4.1.4 Unitized Connector Locations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
4.2 Carrier Models (CxB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
4.2.1 Weight and Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
4.2.2 Clearances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
4.2.3 Mounting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
4.2.4 Auto-docking Assembly Side Rails
4.2.5 Electrical Connector and Indicator Locations
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
. . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
5.0 Electrical Interface
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
5.1 SSA Unitized Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
5.2 Carrier Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
5.3 SSA Link Cable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
5.4 SSA Link Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
5.5 Option Pins and Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
5.5.1 - Manufacturing Test Mode (Option Port Pin 1)
. . . . . . . . . . . . . . . . . . . . . . . . . . 66
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
5.5.2 - Auto Start Pin (Option Port Pin 2)
5.5.3 - Sync Pin (Option Port Pin 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
5.5.4 - Write Protect (Option Port Pin 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
5.5.5 - Ground long (Option Port Pin 5)
5.5.6 - Device Activity Pin/Indicator (Option Port Pin 6) . . . . . . . . . . . . . . . . . . . . . . . . . 67
5.5.7 + 5V (Option Port Pin 7)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
5.5.8 - Device Fault Pin/Indicator (Option Port Pin 8) . . . . . . . . . . . . . . . . . . . . . . . . . . 67
5.5.9 Programmable pin 1 (Option Port Pin 9) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
5.5.10 Programmable pin 2 (Option Port Pin 10)
5.5.11 - Early Power Off Warning or Power Fail (Power Port Pin 11)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
. . . . . . . . . . . . . . . . . 68
5.5.12 12V Charge and 5V Charge (Power Port pin 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . 68
5.6 Front Jumper Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
5.7 Spindle Synchronization
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
5.7.1 Synchronization overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
5.7.2 Synchronization Mode
5.7.3 Synchronization time
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
5.7.4 Synchronization with Offset
5.7.5 Synchronization Route
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
6.0 Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
6.1 Error Detection
6.2 Data Reliability
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
6.3 Seek Error Rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
6.4 Power On Hours Examples: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
6.5 Power on/off cycles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
6.6 Useful Life . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
6.7 *Mean Time Between Failure (*MTBF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
6.7.1 Sample Failure Rate Projections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
6.8 SPQL (Shipped product quality level)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
6.9 Install Defect Free . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
6.10 Periodic Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
6.11 ESD Protection
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
6.12 Connector Insertion Cycles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
7.0 Operating Limits
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
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7.1 Environmental . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
7.1.1 Temperature Measurement Points . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
7.2 Vibration and Shock
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
7.2.1 Drive Mounting Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
7.2.2 Output Vibration Limits
7.2.3 Operating Vibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
7.2.4 Operating Shock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
7.2.5 Nonoperating Shock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
7.3 Contaminants
7.4 Acoustic Levels
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
8.0 Standards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
8.1 Safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
8.2 Electromagnetic Compatibility (EMC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Bibliography . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
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1.0 Description
1.1 Features
1.1.1 General Features
1.12/2.25/4.51 gigabytes formatted capacity (512 bytes/sector)
Serial Storage Architecture (SSA) attachment (dual port)
Brick On Sled carrier and 3.5" small form factor models
Rotary voice coil motor actuator
Closed-loop digital actuator servo (embedded sector servo)
Magnetoresistive (MR) heads
(0,8,6,infinity) 8/9 rate encoding
Partial Response Maximum Likelihood (PRML) data channel with digital filter
All mounting orientations supported
Jumperable auto spindle motor start
Jumperable write protection
Spindle synchronization
Two LED drivers
Bezel (optional)
1.1.2 Performance Summary
Average read seek time (1.12 GB): 6.9 milliseconds
Average read seek time (2.25 GB): 7.5 milliseconds
Average read seek time (4.51GB): 8.0 milliseconds
Average Latency: 4.17 milliseconds
Split read/write control
Media data transfer rate: 9.59 to 12.58 MegaBytes/second (10 bands)
SSA data transfer rate: 20 Megabytes/second
1.1.3 Interface Controller Features
Multiple initiator support
Supports blocksizes from 256 to 5952 bytes
512K byte, multi-segmented, dual port data buffer
Read-ahead caching
Adaptive caching algorithms
Write Cache supported (write back & write thru)
Tagged command queuing
Command reordering
Back-to-back writes (merged writes)
Split reads and writes
Nearly contiguous read/write
Link error recovery procedure exit
Disable registration
Duplicate tags
Two byte ULP message codes
SCSI response
Move data transfer messages
Multiple ULP's
Automatic retry and data correction on read errors
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Automatic sector reallocation
In-line alternate sector assignment for high-performance
Improved technique for down-loadable SSA firmware
1.1.4 Reliability Features
Self-diagnostics on power up
Dedicated head landing zone
Automatic actuator latch
Embedded Sector Servo for improving on-track positioning capability
Buffer memory parity
Longitudinal Redundancy Check (LRC) on Customer Data
ECC on the fly
Error logging and analysis
Data Recovery Procedures (DRP)
Predictive Failure Analysis
(PFA &tm)
No preventative maintenance required
Two Field Replaceable Units (FRU's): Electronics Card and Head Disk Assembly (HDA)
Probability of not recovering data: 10 in 1015 bits read
1.2 Models
The Ultrastar XP SSA disk drive is available in various models as shown below.
The Ultrastar XP SSA data storage capacities vary as a function of model and user block size. The
emerging industry trend is capacity points in multiples of 1.08GB (i.e. 1.08/2.16/4.32) at a block size of 512
bytes. Future IBM products will plan to provide capacities that are consistent with this trend. Users that
choose to make full use of the Ultrastar XP SSA drive capacity above the standard capacity points may not
find equivalent capacity breakpoints in future products.
128-pin HPC
1.12
1.12
2.25
2.25
4.51
4.51
Brick On Sled Carrier
3.5-inch Small FF
Brick On Sled carrier
3.5-inch Small FF
Brick On Sled carrier
3.5-inch Small FF
38-pin Unitized
128-pin HPC
38-pin Unitized
128-pin HPC
38-pin Unitized
Note: CxB models (C1B, C2B, and C4B) include a DC/DC converter, activity and check indicators.
Note: Please refer to section 2.1.1, “Capacity Equations” on page 13 for exact capacities based on user block size.
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2.0 Specifications
All specifications are nominal values unless otherwise noted.
The Ultrastar XP SSA data storage capacities vary as a function of model and user block size. The
emerging Industry trend is capacity points in 1.08GB (i.e. 1.08/2.16/4.32) at a block size of 512 bytes. This
and future products will always plan to provide capacities that are consistent with this trend. Users that
choose to make full use of the Ultrastar XP SSA drive capacity above the standard capacity points may not
find equivalent capacity breakpoints in future products.
2.1 General
Note: The recording band located nearest the disk outer diameter (OD) is referred to as 'Notch #1'. While
the recording band located nearest the inner diameter (ID) is called 'Notch #10'. 'Average' values are
weighted with respect to the number of LBAs per notch when the drive is formatted with 512 byte blocks.
Data transfer rates
Notch #1
12.58
Notch #10 Average
9.59 12.07
Buffer to/from media
Host to/from buffer
MB/s (instantaneous)
up to 20.0 MB/s (synchronous) (sustained)
Data Buffer Size (bytes)
Rotational speed (RPM)
Average latency (milliseconds)
Track Density (TPI)
512 K (See 3.0, “Performance” on page 39 for user data capacity.)
7202.7
4.17
4352
Minimum
96,567
Maximum
Recording density (BPI)
124,970
Areal density (Megabits/square inch) 420.3
543.9
(model numbers - > )
Disks
C4x
8
C2x
4
C1x
2
User Data Heads (trk/cyl)
Seek times (in milliseconds)
Single cylinder (Read)
(Write)
16
8
4
0.5
2.0
8.0
9.5
0.5
0.5
2.0
6.9
8.5
2.0
Average (weighted) (Read)
(Write)
7.5
9.0
Full stroke (Read)
(Write)
16.5
18.0
15.0
16.5
14.0
15.5
Note: Times are typical for a drive population under nominal voltages
and casting temperature of 25˚C. Weighted seeks are seeks to the cylin-
ders of random logical block addresses (LBAs).
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OEM FUNCTIONAL SPECIFICATION ULTRASTAR XP (DFHC) SSA MODELS 1.12/2.25 GB - 1.0" HIGH
Total Cylinders (tcyl)
& User Cylinders (ucyl)
All models C4x Models C2x Models C1x Models
tcyl ucyl ucyl ucyl
Notch #1
Notch #2
Notch #3
Notch #4
Notch #5
Notch #6
Notch #7
Notch #8
Notch #9
Notch #10
1893 1879 1877 1872
956
49
955
48
955
48
955
48
310
349
116
214
190
131
208
309
348
115
213
189
130
206
309
348
115
213
189
130
206
309
348
115
213
189
130
206
Sum of all Notches
4416
4392
4390
4385
Spares Sectors/cylinder (spr/cyl)
C4x Models C2x Models C1x Models
Notch #1
Notch #2
Notch #3
Notch #4
Notch #5
Notch #6
Notch #7
Notch #8
Notch #9
Notch #10
40
40
38
37
36
34
33
32
31
30
20
20
19
19
18
17
17
16
16
15
10
10
10
9
9
9
8
8
8
7
Last cylinder extra spares (lcspr)
60
30
14
User bytes/sector (ub/sct)
256 - 744 (even number of bytes only)
1-8
Sectors/logical block (sct/lba)
The lowest sct/lba that satisfies the following rules is used...
1. Block Length is evenly divisible by a number 2-8.
2. Quotient of previous equation is evenly divisible by 2.
3. Quotient must be ≥ 256 and ≤ 744.
User bytes/logical block (ub/lba)
Sectors/track (sct/trk)
256 - 5952 (See rules for determining sct/lba above for determining sup-
ported ub/lba values.)
(See Table 1 on page 13 or contact an IBM Customer Representative
for other block lengths.)
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Notch #
User bytes /
logical block
1
2
3
4
5
6
7
8
9
10
256
512
520
522
524
528
600
688
744
216
135
128
128
128
128
115
102
96
216
135
128
128
128
128
115
102
96
216
130
128
128
128
126
115
102
96
202
126
123
122
120
120
110
98
195
120
115
115
115
112
102
90
180
115
112
112
112
112
101
90
180
112
108
108
108
108
97
180
108
105
105
105
105
90
180
105
102
102
102
101
90
162
100
99
90
90
90
90
90
90
81
78
90
90
90
81
78
77
73
Table 1. Gross sectors per track for several block lengths
C4x Models
C2x Models
formatted
capacity
(bytes)
C1x Models
User bytes /
logical block
formatted
capacity
(bytes)
logical
blocks /
drive
logical
blocks /
drive
formatted
capacity
(bytes)
logical
blocks /
drive
256
512
520
522
524
528
600
688
744
3,654,540,800
4,512,701,440
4,375,536,880
4,374,300,492
4,385,878,952
4,408,629,984
4,512,402,000
4,604,578,976
4,675,830,192
14,275,550
8,813,870
8,414,494
8,379,886
8,369,998
8,349,678
7,520,670
6,692,702
6,284,718
1,826,312,448
2,255,098,368
2,186,554,760
2,185,931,898
2,191,716,460
2,203,082,640
2,254,925,400
2,300,969,904
2,336,559,528
7,134,033
4,404,489
4,204,913
4,187,609
4,182,665
4,172,505
3,758,209
3,344,433
3,140,537
912,135,680
1,126,337,536
1,092,119,600
1,091,803,716
1,094,691,544
1,100,365,728
1,126,282,800
1,149,310,880
1,167,099,408
3,563,030
2,199,878
2,100,230
2,091,578
2,089,106
2,084,026
1,877,138
1,670,510
1,568,682
Table 2. User capacity for several block lengths
2.1.1 Capacity Equations
2.1.1.1 For Each Notch
The next group of equations must be calculated separately for each notch.
ub/lba
user bytes/sector (ub/sct) =
sct/lba
user sectors/cyl (us/cyl) = (sct/trk)(trk/cyl) - spr/cyl
spares/notch (spr/nch) = (spr/cyl)(ucyl)
Note: Add lcspr to the equation above for the notch closest to the inner diameter (#10).
user sectors/notch (us/nch) = (us/cyl)(ucyl)
Note: Subtract lcspr from the equation above for the notch closest to the inner diameter (#10).
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2.1.1.2 For Entire Drive
10
spares/drive (spr/drv) =
spr/nch
∑
notch = 1
10
user sectors/drive (us/drv) =
us/nch
∑
notch = 1
us/drv
logical blocks/drive (lba/drv) = INT
[sct/lba ]
user capacity (fcap) = (lba/drv)(ub/lba)
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2.2 Power Requirements by Model
2.2.1 C1x Models
The following voltage specifications apply at the drive power connector. There is no special power on/off
sequencing required. The extra power needed for Brick On Sled models and the +38V power option are
described in 2.2.4, “CxB Models” on page 33.
Input Voltage
+ 5 Volts Supply
+ 1 2 Volts Supply
5V (± 5% during run and spin-up)
12V (± 5% during run) ( + 5 % / -7% during spin-up)
The following current values are the combination measured values of SCSI models and SSA Cx4 model. The
differences between SCSI and SSA is + 5 V currents. Because of different interface electronics and speed, SSA
electronics card requires more + 5 V current than SCSI. Read/Write Base Line is 290 ma higher. Idle
Average is 500 ma higher. (290ma and 500ma differences were found by measuring SSA Cx4 model). SSA
+ 5 V current numbers are derived from SCSI + 5 V current numbers by adding 290ma and 500ma accord-
ingly.
Population
Mean
Population
Stand. Dev.
Power Supply Current
+5VDC (power-up)
+5VDC (idle avg)
Notes
Minimum voltage slew rate = 4.5 V/sec
1.23 Amps
1.25 Amps1
.36 Amps
0.02 Amps
+5VDC (R/W baseline)
+5VDC (R/W pulse)
0.05 Amps
0.06 Amps
Base-to-peak
+12VDC (power-up)
+12VDC (idle avg)
Minimum voltage slew rate = 7.4 V/sec
0.28 Amps
0.02 Amps
+12VDC (seek avg)
+12VDC (seek peak)
+12VDC (spin-up)
1 op/sec
0.0027 Amps
1.20 Amps2
1.5 Amps3
0.002 Amps
0.02 Amps
0.1 Amps
3.0 sec max
Drive power
Avg idle power
Avg R/W power
9.51 Watts
.35 Watts
.35 Watts
30 ops/sec
10.58 Watts
1
See Figure 1 on page 18 for a plot of how the read/write baseline and read/write pulse sum together.
2
The idle average and seek peek should be added together to determine the total 12 volt peak current. See Figure 2
on page 19 for a typical buildup of these currents. Refer to examples on the following page to see how to combine
these values.
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2.2.1.1 Power Calculation Examples
Note: The following formulas assume all system ops as a 1 block read or write transfer from a random
cylinder while at nominal voltage condition.
Example 1. Calculate the mean 12 volt average current.
If we assume a case of 30 operations/second then to compute the sum of the 12 volt mean currents the
following is done.
mean
+12VDC (idle average)
0.28 amps
+12VDC (seek average) 0.027 * 30 =
0.081 amps
TOTAL
0.361 amps
Example 2. Calculate the mean plus 3 sigma 12 volt average current.
To compute the sum of the 12 volt mean current's 1 sigma value assume all the distributions are normal.
Therefore the square root of the sum of the squares calculation applies.
operations/second.
Assume a case of 30
sigma
+12VDC (idle average)
0.02 amps
+12VDC (seek average) sqrt(30*((0.0002)**2))=
0.001 amps
TOTAL
sqrt((0.02)**2+(.001)**2))=0.02 amps
So the mean plus 3 sigma mean current is 0.361 + 3*0.02 = 0.42 amps
Example 3. Power Calculation.
Nominal idle drive power = (1.23 Amps * 5 Volts) + (0.28 Amps * 12 Volts) = 9.51 Watts
Nominal R/W drive power at 30 ops/sec = (1.25 Amps * 5 Volts) + (0.361 Amps * 12 Volts) = 10.58
Watts
Mean plus 3 sigma drive power for 30 random R/W operations/second. Assume that the 5 volt and 12 volt
distributions are independent therefore the square root of the sum of the squares applies.
+5VDC (1 sigma power) 0.05 * 5
+12VDC (1 sigma power) 0.02 * 12
= 0.25 watts
= 0.24 watts
Total (1 sigma power) sqrt((0.25)**2+(0.24)**2)
= 0.347 watts
= 10.2 watts
Total power
9.13 + 3 * 0.347
3
The current at start is the total 12 volt current required (ie. the motor start current, module current and voice coil
retract current). See Figure 3 on page 20 for typical 12 volt current during spindle motor start.
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Example 4. Calculate the 12 volt peak current.
To compute the sum of the 12 volt peak currents the following is done.
mean
+12VDC (idle avg)
+12VDC (seek peak)
0.28 amps
1.2 amps
TOTAL
1.48 amps
Example 5. Calculate the mean plus 3 sigma 12 volt peak current.
To compute the sum of the 12 volt peak current's 1 sigma value assume all distributions are normal. There-
fore the square root of the sum of the squares calculation applies.
sigma
+12VDC (idle avg)
+12VDC (seek peak)
0.02 amps
0.02 amps
TOTAL sqrt((0.02)**2+(0.02)**2)=0.028 amps
So the mean plus 3 sigma peak current is 1.48 + 3*0.028 = 1.56 amps
Things to check when measuring 12 V supply current:
Null the current probe frequently. Be sure to let it warm up.
Adjust the power supply to 12.00 V at the drive terminals.
Use a proper window width, covering an integral number of spindle revolutions.
Measure values at 25 degree C casting temperature.
Get a reliable trigger for Seek Peak readings.
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Figure 1. 5 volt current during read/write operations —C1x Models
1. Read/write baseline voltage.
2. Read/write pulse. The width of the pulse is proportional to the number of consecutive blocks read or
written. The 5 volt supply must be able to provide the required current during this event.
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Figure 2. Typical 12 volt current —C1x Models
1. Maximum slew rate is 7 amps/millisecond.
2. Maximum slew rate is 100 amps/millisecond.
3. Maximum slew rate is 7 amps/millisecond.
4. Maximum slew rate is 3 amps/millisecond.
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Figure 3. Typical 12 volt spin-up current —C1x Models
1. Maximum slew rate is 20 amps/millisecond.
2. Current drops off as motor comes up to speed.
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2.2.2 C2x Models
The following voltage specifications apply at the drive power connector. There is no special power on/off
sequencing required. The extra power needed for Brick On Sled models and the +38V power option are
described in 2.2.4, “CxB Models” on page 33.
Input Voltage
+ 5 Volts Supply
+ 1 2 Volts Supply
5V (± 5% during run and spin-up)
12V (± 5% during run) ( + 5 % / -7% during spin-up)
The following current values are the combination measured values of SCSI models and SSA Cx4 model. The
differences between SCSI and SSA is + 5 V currents. Because of different interface electronics and speed, SSA
electronics card requires more + 5 V current than SCSI. Read/Write Base Line is 290 ma higher. Idle
Average is 500 ma higher. (290ma and 500ma differences were found by measuring SSA Cx4 model). SSA
+ 5 V current numbers are derived from SCSI + 5 V current numbers by adding 290ma and 500ma accord-
ingly.
Population
Mean
Population
Stand. Dev.
Power Supply Current
+5VDC (power-up)
+5VDC (idle avg)
Notes
Minimum voltage slew rate = 4.5 V/sec
1.23 Amps
1.25 Amps4
.36 Amps
0.02 Amps
+5VDC (R/W baseline)
+5VDC (R/W pulse)
0.05 Amps
0.06 Amps
Base-to-peak
+12VDC (power-up)
+12VDC (idle avg)
Minimum voltage slew rate = 7.4 V/sec
0.41 Amps
0.02 Amps
+12VDC (seek avg)
+12VDC (seek peak)
+12VDC (spin-up)
1 op/sec
0.0031 Amps
1.20 Amps5
1.5 Amps6
0.0002 Amps
0.02 Amps
0.1 Amps
4.2 sec max
Drive power
Avg idle power
Avg R/W power
11.07 Watts
12.25 Watts
.35 Watts
.35 Watts
30 ops/sec
4
See Figure 4 on page 24 for a plot of how the read/write baseline and read/write pulse sum together.
5
The idle average and seek peek should be added together to determine the total 12 volt peak current. See Figure 5
on page 25 for a typical buildup of these currents. Refer to examples on the following page to see how to combine
these values.
6
The current at start is the total 12 volt current required (ie. the motor start current, module current and voice coil
retract current). See Figure 6 on page 26 for typical 12 volt current during spindle motor start.
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2.2.2.1 Power Calculation Examples
Note: The following formulas assume all system ops as a 1 block read or write transfer from a random
cylinder while at nominal voltage condition.
Example 1. Calculate the mean 12 volt average current.
If we assume a case of 30 operations/second then to compute the sum of the 12 volt mean currents the
following is done.
mean
+12VDC (idle average)
0.41 amps
+12VDC (seek average) 0.0031 * 30 = 0.09 amps
TOTAL
0.50 amps
Example 2. Calculate the mean plus 3 sigma 12 volt average current.
To compute the sum of the 12 volt mean current's 1 sigma value assume all the distributions are normal.
Therefore the square root of the sum of the squares calculation applies.
operations/second.
Assume a case of 30
sigma
+12VDC (idle average)
0.02 amps
+12VDC (seek average) sqrt(30*((0.0002)**2))=
0.001 amps
TOTAL
sqrt((0.02)**2+(.001)**2))=0.02 amps
So the mean plus 3 sigma mean current is 0.50 + 3*0.02 = 0.56 amps
Example 3. Power Calculation.
Nominal idle drive power = (1.23 Amps * 5 Volts) + (0.41 Amps * 12 Volts) = 11.07 Watts
Nominal R/W drive power at 30 ops/sec = (1.25 Amps * 5 Volts) + (0.50 Amps * 12 Volts) = 12.25
Watts
Mean plus 3 sigma drive power for 30 random R/W operations/second. Assume that the 5 volt and 12 volt
distributions are independent therefore the square root of the sum of the squares applies.
+5VDC (1 sigma power) 0.05 * 5
+12VDC (1 sigma power) 0.02 * 12
= 0.25 watts
= 0.24 watts
Total (1 sigma power) sqrt((0.25)**2+(0.24)**2)
= 0.35 watts
= 11.9 watts
Total power
10.8 + 3 * 0.35
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Example 4. Calculate the 12 volt peak current.
To compute the sum of the 12 volt peak currents the following is done.
mean
+12VDC (idle avg)
+12VDC (seek peak)
0.41 amps
1.20 amps
TOTAL
1.61 amps
Example 5. Calculate the mean plus 3 sigma 12 volt peak current.
To compute the sum of the 12 volt peak current's 1 sigma value assume all distributions are normal. There-
fore the square root of the sum of the squares calculation applies.
sigma
+12VDC (idle avg)
+12VDC (seek peak)
0.03 amps
0.02 amps
TOTAL sqrt((0.03)**2+(0.02)**2)=0.036 amps
So the mean plus 3 sigma peak current is 1.61 + 3*0.036= 1.72 amps
Things to check when measuring 12 V supply current:
Null the current probe frequently. Be sure to let it warm up.
Adjust the power supply to 12.00 V at the drive terminals.
Use a proper window width, covering an integral number of spindle revolutions.
Measure values at 25 degree C casting temperature.
Get a reliable trigger for Seek Peak readings.
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Figure 4. 5 volt current during read/write operations —C2x Models
1. Read/write baseline voltage.
2. Read/write pulse. The width of the pulse is proportional to the number of consecutive blocks read or
written. The 5 volt supply must be able to provide the required current during this event.
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Figure 5. Typical 12 volt current —C2x Models
1. Maximum slew rate is 7 amps/millisecond.
2. Maximum slew rate is 100 amps/millisecond.
3. Maximum slew rate is 7 amps/millisecond.
4. Maximum slew rate is 3 amps/millisecond.
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Figure 6. Typical 12 volt spin-up current —C2x Models
1. Maximum slew rate is 20 amps/millisecond.
2. Current drops off as motor comes up to speed.
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2.2.3 C4x Models
The following voltage specifications apply at the drive power connector. There is no special power on/off
sequencing required. The extra power needed for Brick On Sled models and the +38V power option are
described in 2.2.4, “CxB Models” on page 33.
Input Voltage
+ 5 Volts Supply
+ 1 2 Volts Supply
5V (± 5% during run and spin-up)
12V (± 5% during run) ( + 5 % / -7% during spin-up)
The following current values are the combination measured values of SCSI models and SSA Cx4 model. The
differences between SCSI and SSA is + 5 V currents. Because of different interface electronics and speed, SSA
electronics card requires more + 5 V current than SCSI. Read/Write Base Line is 290 ma higher. Idle
Average is 500 ma higher. (290ma and 500ma differences were found by measuring SSA Cx4 model). SSA
+ 5 V current numbers are derived from SCSI + 5 V current numbers by adding 290ma and 500ma accord-
ingly.
Population
Mean
Population
Stand. Dev.
Power Supply Current
+5VDC (power-up)
+5VDC (idle avg)
Notes
Minimum voltage slew rate = 4.5 V/sec
1.26 Amps
1.27 Amps7
.36 Amps
0.02 Amps
+5VDC (R/W baseline)
+5VDC (R/W pulse)
0.05 Amps
0.06 Amps
Base-to-peak
+12VDC (power-up)
+12VDC (idle avg)
Minimum voltage slew rate = 7.4 V/sec
0.77 Amps
0.03 Amps
+12VDC (seek avg)
+12VDC (seek peak)
+12VDC (spin-up)
1 op/sec
0.0036 Amps
1.3 Amps8
2.2 Amps9
0.0002 Amps
0.02 Amps
0.1 Amps
8.5 sec max
Drive power
Avg idle power
Avg R/W power
15.54 Watts
16.91 Watts
.44 Watts
.44 Watts
30 ops/sec
7
See Figure 7 on page 30 for a plot of how the read/write baseline and read/write pulse sum together.
8
The idle average and seek peek should be added together to determine the total 12 volt peak current. See Figure 8
on page 31 for a typical buildup of these currents. Refer to examples on the following page to see how to combine
these values.
9
The current at start is the total 12 volt current required (ie. the motor start current, module current and voice coil
retract current). See Figure 9 on page 32 for typical 12 volt current during spindle motor start.
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2.2.3.1 Power Calculation Examples
Note: The following formulas assume all system ops as a 1 block read or write transfer from a random
cylinder while at nominal voltage condition.
Example 1. Calculate the mean 12 volt average current.
If we assume a case of 30 operations/second then to compute the sum of the 12 volt mean currents the
following is done.
mean
+12VDC (idle average)
0.77 amps
+12VDC (seek average) 0.0036 * 30 = 0.11 amps
TOTAL
0.88 amps
Example 2. Calculate the mean plus 3 sigma 12 volt average current.
To compute the sum of the 12 volt mean current's 1 sigma value assume all the distributions are normal.
Therefore the square root of the sum of the squares calculation applies.
operations/second.
Assume a case of 30
sigma
+12VDC (idle average)
0.02 amps
+12VDC (seek average) sqrt(30*((0.0002)**2))=
0.001 amps
TOTAL
sqrt((0.02)**2+(.001)**2))=0.02 amps
So the mean plus 3 sigma mean current is 0.88 + 3*0.02 = 0.94 amps
Example 3. Power Calculation.
Nominal idle drive power = (1.26 Amps * 5 Volts) + (0.77 Amps * 12 Volts) = 15.54 Watts
Nominal R/W drive power at 30 ops/sec = (1.27 Amps * 5 Volts) + (0.88 Amps * 12 Volts) = 16.91
Watts
Mean plus 3 sigma drive power for 30 random R/W operations/second. Assume that the 5 volt and 12 volt
distributions are independent therefore the square root of the sum of the squares applies.
+5VDC (1 sigma power) 0.05 * 5
+12VDC (1 sigma power) 0.03 * 12
= 0.25 watts
= 0.36 watts
Total (1 sigma power) sqrt((0.25)**2+(0.36)**2)
= 0.44 watts
= 16.8 watts
Total power
15.46 + 3 * 0.44
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Example 4. Calculate the 12 volt peak current.
To compute the sum of the 12 volt peak currents the following is done.
mean
+12VDC (idle avg)
+12VDC (seek peak)
0.77 amps
1.3 amps
TOTAL
2.07 amps
Example 5. Calculate the mean plus 3 sigma 12 volt peak current.
To compute the sum of the 12 volt peak current's 1 sigma value assume all distributions are normal. There-
fore the square root of the sum of the squares calculation applies.
sigma
+12VDC (idle avg)
+12VDC (seek peak)
0.02 amps
0.02 amps
TOTAL sqrt((0.02)**2+(0.02)**2)=0.028 amps
So the mean plus 3 sigma peak current is 2.07 + 3*0.028= 2.1 amps
Things to check when measuring 12 V supply current:
Null the current probe frequently. Be sure to let it warm up.
Adjust the power supply to 12.00 V at the drive terminals.
Use a proper window width, covering an integral number of spindle revolutions.
Measure values at 25 degree C casting temperature.
Get a reliable trigger for Seek Peak readings.
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Figure 7. 5 volt current during read/write operations —C4x Models
1. Read/write baseline voltage.
2. Read/write pulse. The width of the pulse is proportional to the number of consecutive blocks read or
written. The 5 volt supply must be able to provide the required current during this event.
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Figure 8. Typical 12 volt current —C4x Models
1. Maximum slew rate is 7 amps/millisecond.
2. Maximum slew rate is 100 amps/millisecond.
3. Maximum slew rate is 7 amps/millisecond.
4. Maximum slew rate is 3 amps/millisecond.
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Figure 9. Typical 12 volt spin-up current —C4x Models
1. Maximum slew rate is 20 amps/millisecond.
2. Current drops off as motor comes up to speed.
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2.2.4 CxB Models
The carrier models include a DC/DC power converter, device activity and fault/service indicators. There is
no additional current required for + 5 V or +12V.
2.2.4.1 Power supply methods
When +38V is applied to the interface connector pins +38V Source A, +38V Source B, and Ground, the
+ 38V supply is input to a DC/DC converter that provides +12V and + 5 V to the drive electronics.
2.2.4.2 DC/DC Converter
Typical efficiency of this converter is 80% at maximum output load with input voltage at 38V.
There are two independent +38V power supply inputs on the interface connector which supply two inde-
pendent inputs to the DC/DC converter, +38V Source A and +38V Source B (refer to Table 12 on
page 65). The DC/DC converter will operate while one input voltage is in the range of +34V to +40V and
the other input voltage is in the range of 0 to + 4 0 volts. Input voltage ripple must be less than 1.0 volts
peak-to-peak at the fundamental frequency of 420 Hz maximum, less than 500mv at the frequency from
421hz to 1 khz, less than 100mv at the frequency greater than 1 khz. The converter output is + 5 volts at
0.3 amps to 2.6 amps and + 1 2 volts at 0.3 amps to 1.4 amps continuous current. The +12v output can
handle a surge current of 2.2 amps in 9 seconds.
The total input current to the converter is 1.6A amps when the highest input voltage on the power supply
input pins is + 3 4 volts and the converter outputs are operating at full load. The input current ripple, due to
converter switching is no more than 100 milliamps peak-to-peak at 1 MHz Maximum inrush current is
limited to 3 amps during turn on except for a maximum period of 2 microseconds (during hot plugging)
where the current can exceed 3 amps but is less than 8 amps.
A DC/DC converter output enable is provided on the interface connector. This signal, +DC/DC Enable, is
pulled up within the converter. To enable the DC outputs, this line must be at or above 2.4 volts. To
disable the DC outputs, the signal must be at or below 1.4 volts.
The DC/DC converter has over-current, over-voltage, and over-temperature detection. Any of these condi-
tions will latch off the converter. The latch is reset by insuring that both input voltages fall below + 5 volts
for a period greater than or equal to 10 milliseconds.
Refer to 5.5, “Option Pins and Indicators” on page 66 for descriptions of the Early Power Off Warning and
Loss of Redundancy fault signals associated with the +38V supply inputs.
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2.2.5 Power Supply Ripple
Externally Generated Ripple10
as seen at drive power connector
Maximum
Notes
+5VDC
150 mV
0-20 MHz
peak-to-peak
+12VDC
150 mV
0-20 MHz
peak-to-peak
During drive start up and seeking, 12 volt ripple is generated by the drive (referred to as dynamic loading). If
several drives have their power daisy chained together then the power supply ripple plus other drive's
dynamic loading must remain within the regulation tolerance window of + / - 5%. A common supply with
separate power leads to each drive is a more desirable method of power distribution.
2.2.6 Grounding Requirements of the Disk Enclosure
The disk enclosure is at Power Supply ground potential. It is allowable for the user mounting scheme to
common the Disk Enclosure to Frame Ground potential or to leave it isolated from Frame Ground.
From a Electro-Magnetic Compatibility (EMC) standpoint it will, in most cases be preferable to common
the Disk Enclosure to the system's mounting frame. With this in mind, it is important that the Disk Enclo-
sure not become an excessive return current path from the system frame to power supply. The drive's
mounting frame must be within ± 150 millivolts of the drive's power supply ground. At no time should
more than 35 milliamps of current (0 to 100Mhz) be injected into the disk enclosure.
Please contact your IBM Customer Representative if you have questions on how to integrate this drive in
your system.
2.2.7 Hot plug/unplug support
Power supply and SSA link hot plug and un-plug is allowed for all SSA models.
For Form Factor models, there is no special sequence required for connecting 5 volt, 12 volt, or ground.
During a hot plug-in event the drive being plugged will draw a large amount of current at the instant of
plug-in. This current spike is due to charging the bypass capacitors on the drive. This current pulse may
cause the power supply to go out of regulation. If this supply is shared by other drives then a low voltage
power on reset may be initiated on those drives. Therefore the recommendation for hot plugging is to have
one supply for each drive. Never daisy chain the power leads if hot plugging is planned. Hot plugging
should be minimized to prevent wear on the power connector.
The carrier models may be hot plugged ONLY IF the ground pins (longer pin) make contact first (before
other pins which are shorter). Vice versa, the carrier may be hot unplugged ONLY IF the ground pins
(longer pins) are the last to remove (after other pins which are shorter). DAMAGE TO THE FILE ELEC-
TRONICS AND THE ADAPTER ELECTRONICS COULD RESULT IF THE ABOVE CONDITIONS
ARE NOT MET. The mating HPC connector MUST HAVE PROGRAMMABLE PIN LENGTH. GND
PINS MUST BE LONGER THAN SIGNAL AND POWER PINS. THE GUIDE PINS MUST BE TIED
TO THE DOKING ASSEMBLY FRAME GND
10
This ripple must not cause the power supply to the drive to go outside of the ± 5% regulation tolerance.
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Hot plugging the SSA link will be recognized by the next node which will cause a configuration process to
be started by the Initiators.
During hot plugging, the supplies must not go over the upper voltage limit. This means that proper ESD
protection must be used during the plugging event.
During hot un-plugging if the operating shock limit specification can be exceeded then the drive should be
issued a Start/Stop Unit command (spin down) that is allowed to complete before un-plugging.
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2.2.8 Bring-up Sequence (and Stop) Times
Figure 10. Start Time Diagram
Note: BATS is the abbreviation for Basic Assurance Tests. Start-up sequence spins up the spindle motor,
initializes the servo subsystem, up-loads code, performs BATS2 (verifies read/write hardware), resumes
"Reassign in Progress" operations, and more. For more information on the start-up sequence, refer to the
Ultrastar XP (DFHC) SSA Models Interface Specification.
Note: If a RESET is issued before the drive comes ready, the power on sequence will start again. In all
other cases when a RESET is issued the present state of the motor is not altered.
Note: Reference “Start/Stop Unit Time” on page 49 for additional details.
Note: See 5.7, “Spindle Synchronization” on page 69 for details about Start-up time increases when the
device is requested via Mode Parameters to synchronize the spindle motor to another device.
Event
Nominal
1.5 sec
12.4 sec
8.2 sec
6.0 sec
Maximum
2.0 sec
Notes
Power-up
Start-up
Spin-up
*see Figure 10
*see Figure 10
*see Figure 10
45 sec.
29.2 sec
12.0 sec
Spindle Stop
Table 3. Bring-up Sequence Times and Stop Time for C1x Models
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Event
Nominal
1.5 sec
Maximum
2.0 sec
Notes
Power-up
Start-up
Spin-up
*see Figure 10
*see Figure 10
*see Figure 10
17.6 sec
13.2 sec
9.0 sec
45 sec.
29.2 sec
12.0 sec
Spindle Stop
Table 4. Bring-up Sequence Times and Stop Time for C2x Models
Event
Nominal
1.5 sec
Maximum
2.0 sec
Notes
Power-up
Start-up
Spin-up
*see Figure 10 on page 36
*see Figure 10 on page 36
*see Figure 10 on page 36
16.5 sec
11.17 sec
8.0 sec
45 sec.
30.9 sec
12.0 sec
Spindle Stop
Table 5. Bring-up Sequence Times and Stop Time for C4x Models
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3.0 Performance
Drive performance characteristics are dependent upon the workloads run and the environments in which
they are run.
All times listed in this chapter are typical values provided for information only, so that the performance for
environments and workloads other than those shown as examples can be approximated. Actual minimum
and maximum values will vary depending upon factors such as workload, logical and physical operating envi-
ronments.
3.1 Environment Definition
Drive performance criteria is based on the following operating environment. Deviations from this environ-
ment may cause deviations from values listed in this specification.
Block lengths are formatted at 512 bytes per block.
The number of data buffer cache segments is 8. The total data buffer length is 512k bytes. Each
segment is of equal length. Therefore, each cache segment is 64k bytes.
The number of blocks of customer data that can fit into one segment is reduced because 2 bytes of LRC
information is also stored in the segment for each block of customer data stored in the segment. There-
fore, use the following equation to determine how many blocks can fit into one segment.
512KB
# of segments
(
)
ub/lba + 2
Ten byte Read and Write commands are used.
SSA environment consists of a single initiator and single target with no SSA link contention.
The Initiator delay in responding to messages from the Target is assumed to be zero.
All performance enhancing functions are disabled, except where noted. More specifically,
−
−
−
Commands are not queued
Caching is disabled (RCD=1, WCE=0)
Out of order transfers are not allowed (OOTM=0, OOTI=0)
The media is formatted with the skew definition that optimizes the disk data transfer rate for un-
synchronized spindle operation.
All Current Mode Parameters are set to their Default values except where noted.
Averages are based on a sample size of 10,000 operations.
3.2 Workload Definition
The drive's performance criteria is based on the following command workloads. Deviations from these
workloads may cause deviations from this specification.
Operations are either all Reads or all Writes. The specifications for Command Execution Time with
Read Ahead describe exceptions to this restriction. For that scenario all commands are preceded by a
Read command, except for sequential write commands.
The Data Transfer size is set to 64 Blocks.
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The time between the end of an operation, and when the next operation is issued is 50 msec, + / - a
random value of 0 to 50 msec, unless otherwise noted.
3.2.1 Sequential
No Seeks. The target LBA for all operations is the previous LBA + 64.
3.2.2 Random
All operations are to random LBAs. The average seek is an average weighted seek.
3.3 Command Execution Time
Command execution, or service, times are the sum of several Basic Components:
1. Seek
2. Latency
3. Command Execution Overhead
4. Data Transfer to/from Disk
5. Data Transfer to/from SSA Link
The impact or contribution of those Basic Components to Command Execution Time is a function of the
workload being sent to the drive and the environment in which the drive is being operated.
3.3.1 Basic Component Descriptions
Seek
The average time from the initiation of the seek, to the acknowledgement that the R/W head is
on the track that contains the first requested LBA. Values are population averages, and vary as
a function of operating conditions. The values used to determine Command Execution Times
for sequential commands is 0 milliseconds and the values for random commands are shown in
section 2.0, “Specifications” on page 11.
Latency
The average time required from the activation of the read/write hardware until the target sector
has rotated to the head and the read/write begins. This time is 1/2 of a revolution of the disk, or
4.17 milliseconds.
Command Execution Overhead
The average time added to the Command Execution Time due to the processing of the
command. It includes all time the drive spends not doing a disk operation or SSA link data
transfer.
The following values are used when calculating the Command Execution Times.
Workload
Command Execution
Sequential Read
Sequential Write
Random Read
Random Write
.65 ms
1.00 ms
.25 ms
.30 ms
Table 6. Overhead Values
A number of Initiator controlled factors affect Command Execution Overhead. These are exam-
ined separately in 3.4, “Approximating Performance for Different Environments” on page 43.
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The Post Command Processing time of .26 ms is defined as the average time required for process
cleanup after the command has completed. If a re-instruct period faster than this time is used, the
difference is added to the Command Execution Overhead of the next operation.
Data Transfer to/from Disk
The average time used to transfer the data between the media and the drive's internal data buffer.
This is calculated from:
(Data Transferred)/(Media Transfer Rate).
There are four interpretations of Media Transfer Rate. How it is to be used helps decide which
interpretation is appropriate to use.
1. Instantaneous Data Transfer Rate
The same for a given notch formatted at any of the supported logical block lengths. It varies
by notch only and does not include any overhead.
2. Track Data Sector Transfer Rate
Varies depending upon the formatted logical block length and varies from notch to notch. It
includes the overhead associated with each individual sector. This is calculated from:
(user bytes/sector)/(individual sector time)
(Contact an IBM Customer Representative for individual sector times of the various for-
matted block lengths.)
3. Theoretical Data Sector Transfer Rate
Also includes time required for track and cylinder skew and overhead associated with each
track. (See 3.3.2.1, “Theoretical Data Sector Transfer Rate” on page 43 for a description on
how to calculate it.)
4. Typical Data Sector Transfer Rates
Also includes the effects of defective sectors and skipped revolutions due to error recovery.
See Appendix B of the Ultrastar XP (DFHC) SSA Models Interface Specification for a
description of error recovery procedures.
Rates for drives formatted at 512 bytes/block are located in Table 7 on page 42.
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Model Type
Notch #
All
C4x
C2x
C1x
Instant.
Track
Theoretical
Typical
Theoretical
Typical
Theoretical
Typical
Average
12.07
12.58
12.58
12.51
11.96
11.26
11.05
10.64
10.29
10.01
9.59
7.91
8.30
8.30
7.99
7.74
7.38
7.07
6.88
6.64
6.45
6.15
7.17
7.52
7.52
7.22
7.02
6.66
6.41
6.23
6.03
5.85
5.55
7.13
7.48
7.48
7.18
6.99
6.63
6.38
6.20
6.00
5.83
5.53
7.13
7.48
7.48
7.18
6.99
6.63
6.38
6.19
6.00
5.83
5.53
7.10
7.44
7.44
7.15
6.95
6.60
6.35
6.16
5.97
5.80
5.50
7.06
7.40
7.40
7.11
6.92
6.57
6.31
6.13
5.94
5.77
5.48
7.03
7.37
7.37
7.08
6.89
6.54
6.28
6.10
5.91
5.74
5.45
1
2
3
4
5
6
7
8
9
10
9
Note: The values for Typical Data Sector Transfer Rates assume a typically worst case value of 3.16 errors in 10 bits read at
nominal conditions for soft error rate.
Note: Contact an IBM Customer Representative for values when formatted at other block lengths.
Note: "Average" values are sums of the individual notch values weighted by the number of LBAs in the associated notches.
Table 7. Data Sector Transfer Rates. (All rates are in MB/sec)
Data Transfer to/from SSA Link
The time required to transfer data between the SSA link and the drive's internal data buffer, that
is not overlapped with the time for the Seek, Latency or Data Transfer to/from Disk.
When the drive is reading, data is transferred from the medium to its data buffer and from the
buffer across the SSA link simultaneously. However, data transfer to the link from the data
buffer buffer lags transfer from the medium to the buffer by one block. At the end of the transfer
from the medium, one block still has to be transferred across the link.
For a write operation, the data is normally transferred to the data buffer during the seek and
latency time. In the rare case that these are both zero, the write cannot begin until one sector is
transferred, and the time to do this becomes part of the overhead.
Each block of data is transferred as one or more frames on the SSA Link. Each frame requires
10 bytes of overhead and may contain up to 128 bytes of data. The time to transfer one block
depends on the number of frames required. For example, a 744 byte block needs 6 frames (5 x
128 byte, 1 x 104). This adds 60 bytes of overhead making 804 bytes total. At an instantaneous
transfer rate of 20MB/s, that is 40 microseconds per block (17.7MB/s sustained).
3.3.2 Comments
Overlap has been removed from the Command Execution Time calculations. The components of the
Command Execution Times are truly additive times to the entire operation. For example,
The Post Command Processing times are not components of the Command Execution time therefore
they are not included in the calculation of environments where the re-instruct period exceeds the Post
Command Processing time.
The effects of idle time functions are not included in the above examples. The 3.2.1, “Sequential” on
page 40 and 3.2.2, “Random” on page 40 both define environments where the effects due to increased
command overhead of Idle Time Functions upon Command Execution time are less than 0.15%.
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3.3.2.1 Theoretical Data Sector Transfer Rate
This Rate does not account for time required for error recovery or defective sectors (the Typical Data Sector
Transfer Rate described in 3.3.1, “Basic Component Descriptions” on page 40 does include those effects).
Each group of cylinders with a different number of gross sectors per track is called a notch. The following
shows values for notch #1 of C4x models. The "Average" values used in this specification are sums of the
individual notch values weighted by the number of LBAs in the associated notches. For the other notches
and block lengths use values that correspond to those notches and block lengths.
Data Sector Transfer Rate
=
Bytes/cylinder
time for 1 cyl + track skews + 1 cyl skew
Bytes/cylinder
= {(tracks/cyl)(gross sectors/track) - spares/cyl}(user bytes/sector)
= {(16)(135) - 40}(512)
= 1,085,440 Bytes/cyl
time for 1 cyl of data = {(tracks/cyl)(gross sectors/track) - spares/cyl}(avg. sector time)
= {(16)(135) - 40}(.061705)
= 130.815 msec/cyl
time for track skews
time for 1 cyl skew
= (tracks/cyl - 1)(track skew)(avg. sector time)
= (16-1)(13)(.061700)
= 12.032 msec/cyl
= (cylinder skew)(avg. sector time)
= (25)(.061705)
= 1.543 msec/cyl
Data Sector Transfer Rate
=
1,085,440 Bytes
130.815 msec + 12.032 msec + 1.543 msec
= 7.517 MB/sec (Notch #1)
Note: See 2.0, “Specifications” on page 11 for the descriptions of
tracks/cyl (trk/cyl)
gross sectors/track (gs/trk)
spares/cyl (b1spr/cyl and b2spr/cyl)
user bytes/sector (ub/sct)
gross bytes/sector (gb/sct)
See 3.5, “Skew” on page 46 for the descriptions of
track skew (tss)
cylinder skew (css)
Average sector times per notch can be calculated as follows:
average sector time (ast) =
1 sec
120.045 × gs/trk
3.4 Approximating Performance for Different Environments
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3.4.1 For Different Transfer Sizes
The primary performance change due to a change of transfer size is the Data Transfer to/from Disk param-
eter. See 3.3.1, “Basic Component Descriptions” on page 40 for an explanation of the calculation of this
parameter.
The Command Execution Overhead may also change if the transfer size is reduced to the point where certain
internal control functions can no longer be overlapped with either the SSA Link or Disk data transfer.
For example, a short read may incur up to .65ms extra overhead if the Data Ready/Reply exchange does not
overlap the disk transfer.
3.4.2 When Read Caching is Enabled
For read commands with Read Caching Enabled Command Execution time can be approximated by
deleting Seek, Latency, and Data Transfer to/from Disk components if all of the requested data is available
in a cache segment (cache hit). Command Execution Overhead increases by approximately .1ms in this case
as there is no overlap with seek/latency.
When some, but not all, of the requested data is available in a cache segment (partial cache hit) Data
Transfer to/from Disk will be reduced but not eliminated. Seek and Latency may or may not be reduced
depending upon the location of requested data not in the cache and location of the read/write heads at the
time the command was received.
The contribution of the Data Transfer to/from SSA link to the Command Execution time may increase since
a larger, or entire, portion of the transfer may no longer be overlapped with the components that were
reduced.
3.4.3 When Write Caching is Enabled
For write commands with the Write Caching Enabled (WCE) Mode parameter bit set, Command Execution
time can be approximated by deleting Seek, Latency, and Data Transfer to/from Disk components. The
contribution of the Data Transfer to/from SSA link to the Command Execution time may increase since a
larger, or entire, portion of the transfer may no longer be overlapped with the components that were
reduced. The reduced times effectively are added to the Post Command Processing Time.
Command completion status is returned when data is completely stored in the buffer. The time to transfer
this group of data to the disk will be added to the performance of any next command that was in the queue.
3.4.4 When Adaptive Caching is Enabled
The Adaptive Caching feature attempts to increase Read Cache hit ratios by monitoring workload and
adjusting cache control parameters, normally determined by the using system via the Mode Parameters, with
algorithms using the collected workload information.
3.4.5 When Read-ahead is Enabled
If read-ahead is active, the service time is affected in several ways:
If the data requested by a read command is all in the data buffer already, the command can be serviced
very quickly.
If the beginning of the requested data is in the buffer, and the read-ahead is still in progress, data transfer
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for the command can start immediately. This effectively avoids latency time for read operations sequen-
tial on a previous read.
If the data requested by a read operation is not in the read-ahead buffers, there is an increase in the
command overhead time due to the time spent searching the buffers. This time depends on the number
of buffer segments selected by the Mode Select command.
If read-ahead is still in progress when the next command is received and the data requested is not
sequential, the drive aborts read-ahead and starts the command. The time to perform this abort
increases the Command Execution Overhead by .23ms.
3.4.6 When No Seek is Required
For a Read command, the additional Command Execution Overhead when no seek is required is approxi-
mately .50ms. For a Write, it is approximately .70ms.
3.4.7 For Queued Commands
If commands are sent to the drive when it is busy performing a previous command, they can be queued. In
this case, some of the command processing is performed during the previous command and the overhead for
the queued command is reduced by approximately .20 milliseconds.
3.4.7.1 Reordered Commands
If the Queue Algorithm Modifier Mode Parameter field is set to allow it, commands in the device command
queue may be executed in a different order than they were received. Commands are reordered so that the
seek portion of Command Execution time is minimized. The amount of reduction is a function of the
location of the 1st requested block per command and the rate at which the commands are sent to the drive.
A Queue Algorithm Modifier Mode Parameter value of 9 enables an algorithm that gives the using system
the ability to place new commands into the drive command queue execution order relative to the out-
standing commands in the queue. For example, if a request is sent to the drive that the using system prior-
itizes such that it's completion time is more important than one or more of the outstanding commands, the
using system can increase the likelihood that command is executed before those others by using a tag value
greater than those outstanding commands.
3.4.7.2 Back-To-Back Commands
If consecutive read/write commands access contiguous data, they can be serviced without incurring disk
latency between commands.
Note: There is a minimum transfer length for a given environment where continuous access to the disk can
not be maintained without missing a motor revolution. For Write commands with Write Caching enabled
the likelihood is increased that shorter transfers can fulfill the requirements needed to maintain continuous
writing to the disk.
Back-to-back Read is only enabled if Read-ahead is disabled.
3.4.8 Out of Order Transfers
Two bits in the SCSI Command message control out of order transfers. OOTM applies to transfers to/from
the media and OOTI applies to transfers to/from the interface (SSA Link).
The benefit from setting OOTM increases as the transfer length approaches one disk revolution. This affects
both reads and writes and is due to the reduction in latency.
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The full benefit of out of order transfers in only achieved if OOTI is also set. Read data is transferred on the
interface in the same order as it was read from the media.
3.5 Skew
3.5.1 Cylinder to Cylinder Skew
Cylinder skew is the sum of the sectors required for physically moving the heads (csms), which is a function
of the formatted block length and recording density (notch #), and reassign allowance sectors (ras = 3) used
to maintain optimum performance over the normal life of the drive.
Note: The values in the Mode Page 3 'Cylinder Skew Factor' are notch specific non-synchronized spindle
mode values. The value for notch 1 is returned when the Active Notch is set to 0.
Notch #
User bytes / logical
block
1
2
3
4
5
6
7
8
9
10
256
512
520
522
524
528
600
688
744
42
28
26
26
26
26
24
22
21
42
28
26
26
26
26
24
22
21
42
27
26
26
26
26
24
22
21
40
26
26
25
25
25
23
21
20
38
25
24
24
24
24
22
20
20
36
24
24
24
24
24
22
20
20
36
24
23
23
23
23
21
20
18
36
23
22
22
22
22
20
20
18
36
22
22
22
22
22
20
18
17
32
21
21
20
20
20
20
18
17
Note: Contact an IBM Customer Representative for values at other formatted block lengths.
Table 8. Optimal Cylinder Skew for several block lengths
In order to increase the likelihood that equivalent LBA's on two or more devices are located at the same
relative physical position when the devices are used in a synchronized spindle mode, cylinder skew is calcu-
lated differently. The cylinder skew calculations do not take into account known defective sites. To prohibit
revolutions from being missed on cylinder crossings by drives formatted while in a synchronized spindle
mode, an extra allowance for 6 defects is added that is not added when optimally formatted in a non-
synchronized mode.
3.5.2 Track to Track Skew
Note: The values in the SCSI Mode Page 3 'Track Skew Factor' are notch specific values. The value for
notch 1 is returned when the Active Notch is set to 0.
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Notch #
User bytes / logical
block
1
2
3
4
5
6
7
8
9
10
256
512
520
522
524
528
600
688
744
20
13
12
12
12
12
11
10
9
20
13
12
12
12
12
11
10
9
20
13
12
12
12
12
11
10
9
19
12
12
12
12
12
11
10
9
19
12
11
11
11
11
10
9
17
11
11
11
11
11
10
9
17
11
10
10
10
10
10
9
17
10
10
10
10
10
9
17
10
10
10
10
10
9
15
10
10
9
9
9
9
9
8
8
9
9
8
8
8
7
Note: Contact an IBM Customer Representative for values at other formatted block lengths.
Table 9. Track (or Head) Skew for several block lengths
3.6 Idle Time Functions
The execution of various functions by the drive during idle times may result in delays of commands
requested by initiators. ‘Idle time’ is defined as time spent by the drive not executing a command requested
by a initiator. The functions performed during idle time are:
1. Servo Run Out Measurements
2. Servo Bias Measurements
3. Predictive Failure Analysis (PFA)
4. Channel Calibration
5. Save Logs and Pointers
6. Disk Sweep
The command execution time for commands received while performing idle time activities may be increased
by the amount of time it takes to complete the idle time activity. The messages and data exchanged across
the SSA link are not affected by idle time activities.
Note: Command Timeout Limits do not change due to idle time functions.
All Idle Time Functions have mechanisms to lessen performance impacts for critical response time periods of
operation. And in some cases virtually eliminate those impacts from an Initiator's point of view. All Idle
Time Functions will only be started if the drive has not received a SCSI command for at least 5 seconds (40
seconds for Sweep). This means that multiple SCSI commands are accepted and executed without delay if
the commands are received by the drive within 5 seconds after the completion of a previous SCSI command.
This mechanism has the benefit of not requiring special system software (such as issuing SCSI Rezero Unit
commands at known & fixed time intervals) in order to control if and when this function executes.
Note: Applications which can only accommodate Idle Time Function delays at certain times, but can not
guarantee a 5 second re-instruction period, may consider synchronizing idle activities to the system needs
through use of the LITF bit in Mode Select Page 0, and the Rezero Unit command. Refer to the Ultrastar
XP (DFHC) SSA Models Interface Specification for more details
Following are descriptions of the various types of idle functions, how often they execute and their duration.
Duration is defined to be the maximum amount of time the activity can add to a command when no errors
occur. No more than one idle function will be interleaved with each command.
Following the descriptions is a summary of the possible impacts to performance.
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3.6.1 Servo Run Out Measurements
The drive periodically measures servo run out, the amount of wobble on each disk, to track follow more
precisely.
Servo run out for all heads is measured every 60 minutes, therefore the frequency of run out measurements is
dependent on the number of heads a particular model has. The drive attempts to spread the measurements
evenly in time and each measurement takes 100 milliseconds. For example, a model C4x with 8 heads per-
forms one run out measurement every 7 1/2 minutes (60 / 8).
3.6.2 Servo Bias Measurements
The drive periodically measures servo bias, the amount of resistance to head movement as a function of disk
radius. It also helps prevent disk lubrication migration by moving the heads over the entire disk surface.
Servo bias is measured every 12 minutes during the first hour after a power cycle, and every 60 minutes after
that. The measurement takes 200 milliseconds.
3.6.3 Predictive Failure Analysis
Predictive Failure Analysis measures drive parameters and can predict if a drive failure is imminent.
Eight different PFA measurements are taken for each head. All measurements for all heads are taken over a
period of 4 hours, therefore the frequency of PFA is dependent on the number of heads a particular model
has. The drive attempts to spread the measurements evenly in time and each measurement takes about 80
milliseconds. For example, a C4x model with 8 heads will perform one PFA measurement every 3.7
minutes (240 / 8 × 8). For the last head tested for a particular measurement type (once every 1/2 hour), the
data is analyzed and stored. The extra execution time for those occurrences is approximately 40 millisec-
onds.
This measurement/analysis feature can be disabled for critical response time periods of operation by setting
the Page 0h Mode Parameter LITF = 1. The using system also has the option of forcing execution at
known times by issuing the Rezero Unit command if the Page 0h Mode Parameter TCC = 1. All tests for
all heads occur at those times.
Note: Refer to the Ultrastar XP (DFHC) SSA Models Interface Specification for more details about PFA,
LITF, and TCC.
3.6.4 Channel Calibration
The drive periodically calibrates the channel to insure that the read and write circuits function optimally,
thus reducing the likelihood of soft errors.
Channel calibration is done once every 4 hours and typically completes in 20 milliseconds, but may take up
to 64 milliseconds per measurement.
The measurement will only be started if the drive has not received a command for at least 5 seconds. This
means that multiple commands are accepted and executed without delay if the commands are received by the
drive within 5 seconds after the completion of a previous command. This function also makes use of the
mechanism to alter the idle detection period to limit execution for critical response time periods of operation,
if needed.
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3.6.5 Save Logs and Pointers
The drive periodically saves data in logs in the reserved area of the disks. The information is used by the
drive to support various commands and for the purpose of failure analysis.
Logs are saved every 35 minutes. The amount of time it takes to update the logs varies depending on the
number of errors since the last update. In most cases, updating those logs and the pointers to those logs will
occur in less than 30 milliseconds.
3.6.6 Disk Sweep
The heads are moved to another area of the disk if the drive has not received a command for at least 40
seconds. After flying in the same spot for 9 minutes, the heads are moved to another position. Execution
time is less than 1 full stroke seek.
3.6.7 Summary
Idle Time Function Type
Max. Frequency of Occurrence
(minutes)
Duration (ms)
Mechanism to Delay/Disable
Servo Run Out
60/(trk/cyl)
100
200
200
80
Re-instruction Period
Re-instruction Period
Re-instruction Period
Re-instruction Period / LITF
Re-instruction Period
Re-instruction Period
Servo Bias ( < 1st hour)
Servo Bias ( > 1st hour)
PFA
12
60
30/(trk/cyl)
Channel Calibration
Save Logs & Pointers
240
35
64
30
Note: "Re-instruction Period" is the time between consecutive SCSI command requests.
Table 10. Summary of Idle Time Function Performance Impacts
3.7 Command Timeout Limits
The 'Command Timeout Limit' is defined as the time period from when the SCSI_command message is
received by the drive until the corresponding SCSI_status message is transmitted by the drive.
The following times are for environments where Automatic Reallocation is disabled and there are no queued
commands.
Reassignment Time: The drive should be allowed a minimum of 45 seconds to complete a "Reassign
Blocks" command.
Format Time: The time to complete a "Format Unit" command (with Immed bit = 0) varies by model:
C4x 45 minutes
C2x 25 minutes
C1x 15 minutes
Initiators should also use this time to allow format sequences initiated by "Format Unit" commands (with
Immed bit = 1) to compete and place the drive in a "ready for use" state.
Start/Stop Unit Time: The drive should be allowed a minimum of 30 seconds to complete a "Start/Stop
Unit" command (with Immed bit = 0).
Initiators should also use this time to allow start-up sequences initiated by auto start ups and "Start/Stop
Unit" commands (with Immed bit = 1) to complete and place the drive in a "ready for use" state.
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Note: A timeout of one minute or more is recommended but NOT required. The larger system timeout
limit allows the system to take advantage of the extensive ERP/DRP that the drive may attempt in order to
successfully complete the start-up sequence.
Note: A 60 second minimum is required if electronics card replacement is required as a service practice.
Please contact an IBM Customer Representative for more details if required.
Medium Access Command Time: The timeout limit for medium access commands that transfer user data
and/or non-user data should be a minimum of 30 seconds. These commands are:
Log Select
Log Sense
Mode Select
Mode Sense
Pre-Fetch
Read
Read Defect Data
Read Long
Receive Diagnostic Results
Release
Reserve
Rezero Unit
Seek
Send Diagnostic
Verify
Write
Write and Verify
Write Buffer
Write Long
Write Same
Read Capacity
Note: The 30 sec limit assumes the absence of SSA link contention and user data transfers of 64 blocks or
less. This time should be adjusted for anticipated SSA link contention and if longer user data transfers are
requested.
Timeout limits for other commands: The drive should be allowed a minimum of 5 seconds to complete
these commands:
Format Unit (with Immed bit = 1)
Inquiry
Read Buffer
Request Sense
Start/Stop Unit (with Immed bit = 1)
Synchronize Cache
Read Memory
Test Unit Ready
When Automatic Reallocation is enabled add 45 seconds to the timeout of the following commands: Read
(6), Read (10), Write (6), Write (10), Write and Verify, and Write Same.
The command timeout for a command that is not located at the head of the command queue should be
increased by the sum of command timeouts for all of the commands that are performed before it is.
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4.0 Mechanical
4.1 Small Form Factor Models (CxC)
4.1.1 Weight and Dimensions
C1C & C2C Models
C4C Models
U.S.
S.I. Metric
U.S.
S.I. Metric
Weight
Height
Width
Depth
1.00 pounds
1.00 inches
4.00 inches
5.75 inches
0.46 kilograms
25.4 millimeters
101.6 millimeters
146.0 millimeters
1.80 pounds
1.63 inches
4.00 inches
5.75 inches
0.82 kilograms
41.3 millimeters
101.6 millimeters
146.0 millimeters
4.1.2 Clearances
A minimum of 2 mm clearance should be given to the bottom surface except for a 10 mm maximum diam-
eter area around the bottom mounting holes. Figure 11 and Figure 12 show the clearance requirements
(Note 1). For proper cooling it is suggested that a clearance of 6 mm be provided under the drive and on
top of the drive.
There should be 7 mm of clearance between drive's that are mounted with their top sides (see Figure 22 on
page 78 for top view of drive) facing each other.
4.1.3 Mounting
The drive can be mounted with any surface facing down.
The drive is available with both side and bottom mounting holes. Refer to Figure 11 to Figure 13 for the
location of these mounting holes for each configuration.
The maximum allowable penetration of the mounting screws is 3.8 mm.
The torque applied to the mounting screws must be 0.8 Newton-meters ± 0.1 Newton-meters.
The recommended torque to be applied to the mounting screw is 0.8 Newton-meter ± 0.4 Newton-meter.
IBM will provide technical support to users that wish to investigate higher mounting torques in their appli-
cation.
WARNING: The drive may be sensitive to user mounting implementation due to frame distortion effects.
IBM will provide technical support to assist users to overcome mounting sensitivity.
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notes: 1) Bottom clearance required by 4.1.2, “Clearances.”
2) Dimensions are in millimeters.
Figure 11. Location of Side Mounting Holes of C1C & C2C Models
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notes: 1) Bottom clearance required by 4.1.2, “Clearances” on page 51.
2) Dimensions are in millimeters.
Figure 12. Location of Side Mounting Holes of C4C Models
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notes:
1) The purpose of this drawing is to show the bottom hole pattern.
2) Dimensions are in millimeters.
Figure 13. Location of Bottom Mounting Holes of CxC Models
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4.1.4 Unitized Connector Locations
The Unitized connector is located on the left side of the top view (bottom drawing) as shown in Figure 14
on page 56. The jumper connector is located on the right side of the top view (bottom drawing) as shown
in Figure 14 on page 56. This jumper connector is referred to as Front Jumper because of its front
location. It is reserved for IBM Engineering used only.
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Figure 14. Electrical connectors (rear and top view) -- CxC Models.
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4.2 Carrier Models (CxB)
The carrier model assemblies include the disk drive, drawer mounting hardware (rails, latching mechanism,
and connector), and DC/DC power converter.
4.2.1 Weight and Dimensions
C1B & C2B Models
C4B Models
U.S.
S.I. Metric
U.S.
S.I. Metric
Weight
Height
Width
Depth
2.00 pounds
1.75 inches
4.26 inches
10.72 inches
0.92 kilograms
44.5 millimeters
108.3 millimeters
272.3 millimeters
2.80 pounds
1.75 inches
4.26 inches
10.72 inches
1.288 kilograms
44.5 millimeters
108.3 millimeters
272.3 millimeters
Refer to Figure 15 on page 58 for detailed dimensions.
4.2.2 Clearances
For proper cooling, a clearance of 6 millimeters should be provided above and below the carrier surfaces.
Adequate airflow is needed in order to meet the operating specifications. Maximum temperatures are speci-
fied for critical drive components in Table 15 on page 78.
4.2.3 Mounting
The drive can be mounted with any surface facing down.
The carrier is designed to be plugged into an auto-docking assembly. The auto-docking assembly contains
an electrical receptacle that provides connections for DC power, SSA interface signals, and fault sensing and
reporting signals (see 5.2, “Carrier Connector” on page 64). The carrier design allows for positive retention
of the carrier in all axes when plugged into the auto-docking assembly. In addition, the carrier retention
provides a force to bottom out the carrier auto-docking connector into the auto-docking assembly and main-
tain a force of 5 pounds minimum, 40 pounds maximum.
The mating connector should contain two guide pins to align the carrier receptacle during seating. These
guide pins are BERG part number 77693-014 (IBM part number 72G0343) or AMP equivalent part number
1-532808-1 (IBM part number 19G6789). The guide pin length should be 26.04 millimeters while the thread
depth depends upon the thickness of the circuit board the connector is mounted to. The guide pins should
be tied to the docking assembly frame ground.
Note: The connector pins must be lubricated to insure seating of the carrier into the auto-docking assembly.
The type of lubricant recommended is Stauffer CL-920 or equivalent.
WARNING: The drive may be sensitive to user mounting implementation due to frame distortion effects.
IBM will provide technical support to assist users to overcome mounting sensitivity.
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Note: Dimensions are in millimeters.
Figure 15. Dimensions —CxB Models
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Figure 16. Handle Docking and Ejection System
The handle on the carrier is used for insertion into and extraction from the drawer. It also provides enough
force to ensure seating of the carrier electrical receptacle with the mating connector. Referring to Figure 16,
with the handle in the STOP or open position, a carrier inserted into the auto-docking assembly will have
the connector guide pins inserted into the carrier receptacle but the connector pins will not be making
contact with the carrier receptacle. Moving the carrier handle to the CAM IN position and eventually to the
LOCKED position sets the auto-docking connector with the carrier receptacle and holds the carrier in all the
mounting positions listed above. Moving the handle from the LOCKED position to the EJECT position
provides leverage via the cam surface on the handle acting against the side rails to separate the connector
pins from the receptacle.
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4.2.4 Auto-docking Assembly Side Rails
IBM supplied side rails that can be used for the auto-docking assembly are shown in Figure 17 on page 61
along with mounting location information. Refer to the figure for the following notes:
Note 1: With the side rails mounted within the given tolerances, there will be a nominal 1.5 millimeter
interference between the handle and side rail to provide positive retention of the carrier and the
handle.
Note 2: The IBM part number of the auto-docking side rails is 36G6422.
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Figure 17. Side Rail Positioning
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4.2.5 Electrical Connector and Indicator Locations
The HPC electrical connectors are located as shown in Figure 15 on page 58. The indicators (LEDs) are
located as shown in Figure 18 on page 62.
Figure 18. LED Locations (front view) —CxB Models.
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5.0 Electrical Interface
5.1 SSA Unitized Connector
Electrical connections for CxC models are provided by a single connector mounted on the rear of the drive
(see Figure 14 on page 56). Connections are provided for two SSA ports, fault sensors and indicators,
option customization, and power. Refer to Figure 19 and Table 11 on page 64 for contact assignments.
Figure 19. Unitized Connector (looking in the file at the connector end)
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Pin
SSA PORT
SSA PORT
OPTION PORT
POWER PORT
1
+ Line Out
+ Line Out
- MTM
+ 12V Charge
(long)
2
- Line Out
Gnd (long)
Gnd (long)
- Line In
+ Line In
N/A
- Line Out
Gnd (long)
Gnd (long)
- Line In
+ Line In
N/A
- Auto Start
- Sync
+ 5V Charge (long)
Gnd (long)
+ 12V
3
4
- Write Protect
Gnd (long)
- Device Activity
+ 5V
5
+ 12V
6
+ 12V
7
Gnd (long)
Gnd (long)
+ 5V
8
N/A
N/A
- Device Fault
Programmable 1
Programmable 2
N/A
9
N/A
N/A
10
11
12
13
14
15
16
N/A
N/A
+ 5V
N/A
N/A
- Power Fail
GND (long)
+ 3.3V
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
+ 3.3V
N/A
N/A
N/A
Gnd (long)
Gnd (long)
N/A
N/A
N/A
Table 11. Electrical Connector Contact Assignments —CxC Models
5.2 Carrier Connector
Electrical connections for CxB models are provided by a single 128 pin connector mounted on the rear of
the drive (see Figure 15 on page 58 for location). Connections are provided for two SSA ports, fault
sensors and indicators, and power. The receptacle used is a 4×32, female contact, BERG HPC connector,
IBM part number 99F9429. Refer to Figure 20 and Table 12 on page 65 for contact assignments.
Figure 20. Carrier Interface Receptacle
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Row
1
A
B
C
D
n/c
n/c
n/c
n/c
2
n/c
n/c
n/c
n/c
3
n/c
n/c
n/c
n/c
4
n/c
n/c
n/c
n/c
5
n/c
n/c
n/c
n/c
6
n/c
n/c
n/c
n/c
7
n/c
n/c
n/c
Device Fault (*)
8
+38V Source A
+38V Source A
+38V Source A
+38V Source A
9
+38V Source A
+38V Source A
+38V Source A
+38V Source A
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
Note:
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
+38V Source B
+38V Source B
+38V Source B
+38V Source B
+38V Source B
n/c
+38V Source B
n/c
+38V Source B
n/c
+38V Source B
n/c
n/c
n/c
n/c
n/c
n/c
n/c
n/c
n/c
Shield
+ Out 1
− Out 1
Shield
+ In 1
− In 1
Shield
n/c
Shield
+ Out 1
− Out 1
Shield
+ In 1
− In 1
Shield
n/c
Shield
+ In 2
− In 2
Shield
+ Out 2
− Out 2
Shield
n/c
Shield
+ In 2
− In 2
Shield
+ Out 2
− Out 2
Shield
n/c
n/c
n/c
n/c
n/c
n/c
n/c
n/c
n/c
n/c
n/c
n/c
n/c
n/c
n/c
n/c
n/c
n/c
n/c
n/c
n/c
n/c
n/c
n/c
n/c
n/c
n/c
n/c
n/c
n/c
n/c
n/c
n/c
"n/c" means "no connection" (not used).
(*) means pin is reserved for this function but model CxB does not provide connection to support it.
Table 12. Electrical Connector Contact Assignments —CxB Models
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5.3 SSA Link Cable
The SSA link cable must meet the specifications described in the Electrical Specifications section of Serial
Storage Architecture SSA-PH (Transport Layer), X3T10.1/94-015 rev 01.
5.4 SSA Link Electrical Characteristics
The drive SSA link line driver, line receiver, and line receiver termination are fully compliant with the specifi-
cations described in the Electrical Specifications section of Serial Storage Architecture SSA-PH (Transport
Layer), X3T10.1/94-015 rev 01.
5.5 Option Pins and Indicators
Ultrastar XP SSA drives contain option pins and/or indicators used to sense and report fault conditions, and
to enable certain features of the drive. The electrical characteristics and requirements of these pins are fully
compliant with the specifications described in the Electrical Specification section of Serial Storage Architec-
ture SSA-PH (Transport Layer), X3T10.1/989D rev 01. The existence and definition of these pins are model
dependent. Refer to Figure 14 on page 56 and Figure 18 on page 62 for locations of pins and LEDs on
the front of the drive. Refer to Table 11 on page 64 and Table 12 on page 65 for locations of pins on the
rear of the drive.
5.5.1 - Manufacturing Test Mode (Option Port Pin 1)
A low active input pin, that when active (pulled below .8V) makes pins 2, 3, 4, 6, 8 ,9 and 10 available to
be redefined. Pins 5 and 7 must remain Ground and + 5 V respectively. One possible purpose for this pin is
to allow a manufacturing tester to redefine the option pins to whatever functions it desires, while allowing
the shipped product to return to the standard definitions in the customers environment. All models (CxC
and CxB) reserve this pin but it is not connected to any internal logic.
5.5.2 - Auto Start Pin (Option Port Pin 2)
A low active input pin, that when active (pulled below 0.8 V) on CxC model causes the drive motor to spin
up and become ready for media access operations after power is applied without the need to receive a
Start/Stop Unit command. When inactive (pulled above 2.0 V), the drive motor shall not spin up until after
the receipt of a Start/Stop Unit command. The signal is to be sampled by the device at power on, or hard
reset or soft reset conditions. Refer to the "Option Pins" section of the Ultrastar XP (DFHC) SSA Models
Interface Specification for a detailed functional description of operations associated with this pin.
This pin is not accessible on CxB models.
5.5.3 - Sync Pin (Option Port Pin 3)
The Sync input/output pin on CxC model can be used for synchronizing among devices. The synchroniza-
tion is achieved by having one device uses this pin as output to transmit one sync character once per its
spindle revolution. The other node may use this pin as an input and synchronize their spindle revolution
position to match the Sync signal. The SSA network provide Sync character over SSA link, but this option
pin allows synchronization across multiple SSA networks, or allow tighter latency of the Sync pulse. Refer to
Figure 21 on page 70 for examples of Synchronization connection.
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The width, period, and tolerance of the negative active Sync pulse is manufacturer dependent, and thus syn-
chronization across different manufacturers or even different product lines of the same manufacturer is not
guaranteed. The Sync pin usage is controlled by mode pages within the mode select command.
This pin is not accessible on CxB model.
5.5.4 - Write Protect (Option Port Pin 4)
a low active input pin, that when active (pulled below 0.8 V), the drive will prohibit commands that alter the
customer data area portion of the the media from being performed. The state of this pin is monitored on a
per command basis. Refer to "Option pins" section of the Ultrastar XP (DFHC) SSA Models Interface
Specification for a detailed functional description of this pin.
This pin is not accessible on CxB models.
5.5.5 - Ground long (Option Port Pin 5)
The Ground long output pin on CxC and CxB models shall be capable of syncing 1.0 Amp of current. This
pin is longer than any others in the option block to allow for the ground to mate first or last in a hot-plug or
hot-unplug situation.
5.5.6 - Device Activity Pin/Indicator (Option Port Pin 6)
A low active LED output pin on CxC models can be used to drive an external Light Emitting Diode. CxB
models have an integrated Green LED. Refer to the "Option Pins" section of the Ultrastar XP (DFHC)
SSA Models Interface Specification for a detailed functional description of this pin/LED.
CxC models provide up to 24 mA of TTL level LED sink current capability. Current limiting for the LED
is provided on the electronics card. The anode may be tied to the + 5 V power source (provided on the the
unitized connector). The LED Cathode is then connected to the Device Activity pin to complete the circuit.
5.5.7 + 5V (Option Port Pin 7)
The + 5V output pin on CxC and CxB models shall supply up to 1.0 Amp of current limited + 5 V ( + / -
10%), as long as power is supplied to the device.
5.5.8 - Device Fault Pin/Indicator (Option Port Pin 8)
The Device Fault pin on CxC models can be used to drive an external Light Emitting Diode. CxB models
have an integrated Amber LED. Refer to the "Option Pins" section of the Ultrastar XP (DFHC) SSA
Models Interface Specification for a detailed functional description of this pin/LED.
CxC models provide up to 24 mA of TTL level LED sink current capability. Current limiting for the LED
is provided on the electronics card. The anode may be tied to the + 5 V power source (provided on the the
unitized connector). The LED Cathode is then connected to the Device Fault pin to complete the circuit.
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5.5.9 Programmable pin 1 (Option Port Pin 9)
This pin can be used by a manufacturer for what ever purposes it desires within the specified definition,
electrical characteristic and the availability of microcode. This pin is completely controlled by microcode.
Refer to the "Option Pins" section of the Ultrastar XP (DFHC) SSA Models Interface Specification for a
detailed functional description of this pin.
This pins is not accessible externally on CxB models.
5.5.10 Programmable pin 2 (Option Port Pin 10)
This pin is reserved and it is not connected to any internal logic.
This pins is not accessible externally on CxB models.
5.5.11 - Early Power Off Warning or Power Fail (Power Port Pin 11)
The Early Power Off Warning input pin on CxC models can be used to indicate to the drive that a power
loss will occur by pulling this signal to ground. The input must provide a minimum of 6 milliseconds
warning before power falls below operating specifications in order for the drive to stop its activities and
handle the fault. Refer to the "Option Pins" section of the Ultrastar XP (DFHC) SSA Models Interface
Specification for a detailed functional description of the fault handling associated with this pin..
This pin is not accessible on CxB models.
5.5.12 12V Charge and 5V Charge (Power Port pin 1 and 2)
These pins are longer than the others. They help to reduce current spikes during hot plug. Each pin require a
resistor (not in the drive) in series between the power source and the drive connector. This allows for more
controlled current draw as prior to other voltage pins. It is up to the subsystem to determine the proper
resistance to add to these pins to meet the + / - 10% voltage drop limitations and the current draw limitation
of the connector.
These pins are not accessible on CxB models
5.6 Front Jumper Connector
All models contain a jumper block (refer to Figure 14 on page 56) that is reserved for IBM Engineering use
only.
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5.7 Spindle Synchronization
5.7.1 Synchronization overview
Spindle synchronization of drives is achieved by one node transmitting a special Sync character or a Sync
pulse once per every revolution of its drive. The transmitting is done either on SSA Link (sending Sync
character) or on a hard-wire (Sending Sync pulse) that connects all the drives via the SSA Option Port
'Sync' pin. The synchronization mode is controlled by the RPL field of the Mode Select Page 04h parameter
(see Ultrastar XP (DFHC) SSA Models Interface Specification for more details). The drive can operate in
one of three modes:
5.7.2 Synchronization Mode
Mode
Operation
No Sync
Slave Sync
Spindle synchronization is disabled.
Spindle synchronization is attempted by synchronizing the spindle motor to the Sync
special character on SSA link (or the Sync pulse on Sync hard-wire) that is driven by
another node.
Master Sync
Spindle synchronization is not attempted by this device. It generates a Sync special
character via SSA link (or a Sync pulse via a hard-wire) once per its spindle revo-
lution.
Master Sync Control Master Sync Control is not supported.
5.7.3 Synchronization time
It will take 6 seconds to synchronize the Slave drive to the Master drive. While the Slave drive is synchro-
nizing to these characters, it is not able to read or write data. Once synchronized the drive will maintain ±
20 microseconds synchronization tolerance.
When operating in Slave Sync mode, the drive must receive the Spindle Sync special characters at a period of
8.333 milliseconds with a tolerance of ± .025% (2.08 microseconds).
5.7.4 Synchronization with Offset
The Rotational Offset value is the amount of rotational skew that the Target uses when synchronized. The
rotational skew is applied in the retarded direction (lagging the synchronized spindle master control). The
value in the field is the numerator of a fractional multiplier that has 256 as its denominator (e.g., a value of
128 indicates a one-half revolution skew). A value of 00h indicates that rotational offset is not used. The
rotational offset is only used when the Drive is running in the Slave Sync RPL mode.
5.7.5 Synchronization Route
5.7.5.1 Over SSA Link
Spindle Sync special characters are forwarded from one SSA link to the other with a delay of 350
nanoseconds with a tolerance of ± 50 nanoseconds. This delay can be increased by 50 nanoseconds when
the drive is sending the second of a double character sequence (RR or ACK) and by 50 nanoseconds when
sending a SAT or SAT' character.
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The spindle synchronization timing requirements are met in a string composed of Ultrastar XP SSA drives
when there are no more than seventeen drives between the one operating in Master Sync mode and the
furthest drive operating in Slave Sync mode.
5.7.5.2 Over Sync Hard-wire
There will be a single wire that connects all the drives together throught the SSA Option Port pin 3 (- Sync
pin). One of these drives will be a Master drive. Two potential configurations of this hard-wire connection
are shown in the following figures:
Figure 21. Two examples of Daisy-Chain Connection of Synchronization
.
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Termination
Bus termination of the - SYNC signals is internal to the drive. This signal has a 5.1K ohm pulled-up to
the + 5 volt supply. A maximum of 30 drives can have their - SYNC line daisy chained together. Vio-
lating this could damage the Master drive line driver on the - SYNC line
It is the using system's responsibility to provide the cable to connect the - SYNC line where needed, of
the synchronized drives.
Bus Characteristics
−
−
−
−
−
−
−
−
maximum Bus length = 6 meters
2 micro-second negative active pulse (when sourced by drive)
minimum of 1 micro-second negative active pulse when externally sourced
0.8 volts = valid low input
2.2 volts = valid high input
0.4 volts = low output
Vcc volts = High output
30 milli-amps = maximum output low level sink current
The driver used for these two signal lines is a Open Drain buffer.
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6.0 Reliability
Note: The reliability projections are based on the conditions stated below. All of the SSA models will meet
the projections as long as reliability operating conditions are not exceeded.
6.1 Error Detection
Error reporting ≥ 99%
All detected errors excluding interface and BATs #1 (Basic Assur-
ance Test) errors
Error detection ≥ 99%
FRU isolation = 100%
To the device when the "Recommended Initiator Error Recovery
Procedures" in the Ultrastar XP (DFHC) SSA Models Interface
Specification are followed.
No isolation to sub-assemblies within the device are specified.
6.2 Data Reliability
Probability of not recovering data
10 in 1015 bits read
Recoverable read errors
10 in 1013 bits read (measured at nominal DC conditions and room
environment with default error recovery —QPE**)
Probability of miscorrecting unrecoverable data
Note: Eighteen bytes of ECC and two bytes of LRC are provided for each data block.
6.3 Seek Error Rate
The drives are designed to have less than 10 errors in 10,000,000 seeks. In the field, a seek error rate of 40 in
100, 000 seeks will trip PFA (Predictive Failure Analysis) error.
The drives are designed to achieve Soft Seek Error rate of 1 error in 100,000,000 seeks.
6.4 Power On Hours Examples:
Maximum power on hours (with minimum power on/off cycles)
43,800 hours for life based on:
- 5 Power on/off cycles per month
- 730 power on hours per month
Nominal power on hours (with nominal power on/off cycles)
30,000 hours for life based on:
**
Refer to Ultrastar XP (DFHC) SSA Models Interface Specification for the definition of QPE (Qualify Post Error).
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- 25 Power on/off cycles per month
- 500 power on hours per month
6.5 Power on/off cycles
Maximum on/off cycles
1080/ year
5 Years
6.6 Useful Life
Product Life
Useful life is the length of time prior to the point at which product degradation begins to occur. The specifi-
cation for the useful life calculation is the same as that for the *MTBF specification.
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6.7 *Mean Time Between Failure (*MTBF)
The mean time to failure target is 1,000,000 device hours per fail (3.0% CDF) based on the following
assumptions:
6000 power on hours per year (500 power on hours per month times 12 months)
300 average on/off cycles per year (25 power cycles per month times 12 months)
Seeking/Reading/Writing is assumed to be 20% of power on hours (Approximately 10 read/write oper-
ations per second)
Operating at or below the Reliability temperature specifications (See Table 15 on page 78) and nominal
voltages (See 2.2, “Power Requirements by Model” on page 15)
Note: *MTBF - is a measure of the failure characteristics over total product life. *MTBF includes normal
integration induced, installation, early life (latent), and intrinsic failures. *MTBF is predicated on supplier
qualification, product design verification test, and field performance data.
6.7.1 Sample Failure Rate Projections
The following tables are for reference only. The tables contain failure rate projections for a given set of user
conditions. Similar projections will be provided, upon request, for each user specific power on hour and
power cycles per month condition. Contact your IBM customer representative for a customized projection.
Application
Electronics only - (RA/MM)
500POH/MM
730POH/MM
0.00120
0.00160
0.0010
0.00096
0.00125
0.00036
0.00047
2.1%
2.8%
0.00140
Table 13. Projected failure rates for the electronics only.
Application
Electronics and HDA - (RA/MM)
500POH/MM
730POH/MM
0.00150
0.00200
0.00130
0.00170
0.00120
0.00160
0.00050
0.00070
3.0%
4.1%
Table 14. Projected failure rates for the entire drive. (Electronics and HDA).
6.8 SPQL (Shipped product quality level)
LA vintage
.25%
Ultimate (13th month)
.10%
Targets
6.9 Install Defect Free
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Install Defect Free percentage
99.99 percent
6.10 Periodic Maintenance
None required
6.11 ESD Protection
The Ultrastar XP SSA disk drives contain electrical components sensitive to damage due to electrostatic
discharge (ESD). Proper ESD procedures must be followed during handling, installation, and removal. This
includes the use of ESD wrist straps and ESD protective shipping containers.
6.12 Connector Insertion Cycles
Live insertion and removal of the electrical connector causes pitting on the connector terminals. Because of
this the number of live insertion and removal cycles must be limited.
Maximum Insertion/Removal Cycles (for hot and normal insertion) 25
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7.0 Operating Limits
The IBM Corporate specifications and bulletins, such as C-S 1-9700-000 in the contaminants section, that
are referenced in this document are available for review. (Please contact your IBM Customer)
7.1 Environmental
Temperature
Operating Ambient
Operating Casting Temperature
Storage
41 to 131˚F (5 to 55˚C)
41 to 158˚F (5 to 70˚C)
34 to 149˚F (1 to 65˚C) See Note
-40 to 149˚F (-40 to 65˚C)
Shipping
Temperature Gradient
Operating
Shipping and storage
36˚F (20˚C) per hour
below condensation
Humidity
Operating
Storage
Shipping
5% to 90% noncondensing
5% to 95% noncondensing
5% to 100% (Applies at the packaged level)
Wet Bulb Temperature
Operating
Shipping and Storage
80˚F (26.7˚C) maximum
85˚F (29.4˚C) maximum
Elevation
Operating and Storage
Shipping
-1000 to 10,000 feet (-304.8 to 3048 meters)
-1000 to 40,000 feet (-304.8 to 12,192 meters)
Note: Guidelines for storage below 1˚C are given in IBM Technical Report TR 07.2112.
7.1.1 Temperature Measurement Points
The following is a list of measurement points and their temperatures (maximum and reliability). Maximum
temperatures must not be exceeded at the worst case drive and system operating conditions with the drive
randomly seeking, reading and writing. Reliability temperatures must not be exceeded at the nominal drive
and system operating conditions with the drive randomly seeking, reading, and writing.
There must be significant air flow through the drive so that the casting and module temperature limits define
in Table 15 are not exceeded. Figure 22 on page 78 defines where measurements should be made to deter-
mine the top casting temperature during drive operation. Figure 23 on page 79 identify the module
locations on the bottom side of the card and the measurement location on the bottom of the casting.
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Table 15. Maximum and Reliability Operating Temperature Limits
Maximum
Reliability
Disk Enclosure Top
Disk Enclosure Bottom
PRDF Prime Module
WD 61C40 Module
SIC Module
158˚F (70˚C)
158˚F (70˚C)
203˚F (95˚C)
185˚F (85˚C)
203˚F (95˚C)
194˚F (90˚C)
194˚F (90˚C)
185˚F (85˚C)
194˚F (90˚C)
131˚F (55˚C)
131˚F (55˚C)
176˚F (80˚C)
167˚F (75˚c)
176˚F (80˚C)
167˚F (75˚C)
167˚F (75˚C)
167˚F (75˚C)
167˚F (75˚C)
Microprocessor Module
VCM FET
DC/DC Converter (CxB only)
SMP FET
Note 1: Module temperature measurements should be taken from the top surface of the module.
Note 2: If copper tape is used to attach temperature sensors, it should be no larger than 6 square milli-
meters.
notes: 1) dimensions are in millimeters.
Figure 22. Temperature Measurement Points for All Models (top view of DE)
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Notes:
1) Center thermocouple on the top surface of the module.
2) If copper tape is used to attach temperature sensors, it should be no
larger than 6 mm square.
3) Dimensions are in millimeters.
4) The connector (on the left edge) does not represent SSA connector.
Figure 23. Temperature Measurement Points for all Models (bottom view)
7.2 Vibration and Shock
The operating vibration and shock limits in this specification are verified in two mount configurations for
CxC models:
1. By mounting with the 6-32 bottom holes with the drive on 2 mm clearance as required by 4.1.2,
“Clearances” on page 51
2. By mounting on any two opposing pairs of the 6-32 side mount holes.
CxB models are mounted rigidly to the test fixture using the carrier guides, connector, and latch mechanism.
The test fixture is then mounted to the vibration table (the test fixture must not have any resonance within
the frequencies tested).
Other mount configurations may result in different operating vibration and shock performance.
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7.2.1 Drive Mounting Guidelines
The following guidelines may be helpful as drive mounting systems are being designed.
1. Mount the drive to its carrier/rack using the four extreme side holes to ensure that the drive's center of
gravity is as close as possible to the center of stiffness of the mounting.
2. Do not permit any metal-to-metal impacts or chattering between the carrier/rack and the drive or
between the carrier/rack and anything else. Metal-to-metal impacts create complex shock waveforms
with short periods; such waveforms can excite high frequency modes of the components inside the drive.
3. The carrier/rack should not allow the drive to rotate in the plane of the disk and the carrier/rack itself
should be mounted so that it does not rotate in the plane of the disk when the drive is running. Even
though the drive uses a balanced rotatory actuator, its position can still be influenced by rotational accel-
eration.
4. Keep the rigid body resonances of the drive away from harmonics of the spindle speed. Consider not
only the drive as mounted on its carrier but also when the drive is mounted to a carrier and then the
carrier is mounted in a rack, the resonances of the drive in the entire system must be considered.
7200 RPM Harmonics: 120 hz, 240 hz, 360 hz, 480 hz, .....
5. When the entire system/rack is vibration tested, the vibration amplitude of the drive as measured in all
axis should decrease significantly for frequencies above 300 hz.
6. Consider the use of plastics or rubber in the rack/carrier design. Unlike metal, these materials can
dampen vibration energy from other drives or fans located elsewhere in the rack.
7. Rather that creating a weak carrier/rack that flexes to fit the drive/carrier, hold the mounting gap to
tighter tolerances. A flexible carrier/rack may contain resonances that cause operational vibration and/or
shock problems.
7.2.2 Output Vibration Limits
spindle imbalance
1.0 gram-millimeters maximum for C1x, C2x models
1.5 gram-millimeters maximum for C4x model
7.2.3 Operating Vibration
The vibration is applied in each of the three mutually perpendicular axis, one axis at a time. Referring to
Figure 24 on page 81, the x-axis is defined as a line normal to the front/rear faces, the y-axis is defined as a
line normal to the left side/right side faces, and the z-axis is normal to the x-y plane.
WARNING: The Ultrastar XP SSA drives are sensitive to rotary vibration. Mounting within using
systems should minimize the rotational input to the drive mounting points due to external vibration.
IBM will provide technical support to assist users to overcome problems due to vibration.
Random Vibration
For excitation in the x-direction and the y-direction, the drive meets the required throughput specifications
when subjected to vibration levels not exceeding the V4 vibration level defined below.
For excitation in the z-direction, the drive meets the required throughput specifications when subjected to
vibration levels not exceeding the V4S vibration level defined below.
Note: The RMS value in the table below is obtained by taking the square root of the area defined by the
g²/hz spectrum from 5 to 500 hz.
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Table 16. Random Vibration Levels
Class 5 hz
17 hz
45 hz
48 hz
62 hz
65 hz
150 hz
1.0E-3
1.0E-3
200 hz
8.0E-5
4.0E-5
500 hz
8.0E-5
4.0E-5
RMS
0.56
0.55
g
V4
2.0E-5 1.1E-3
2.0E-5 1.1E-3
1.1E-3
1.1E-3
8.0E-3
8.0E-3
8.0E-3
8.0E-3
1.0E-3
1.0E-3
V4S
units
g2/hz
Swept Sine Vibration
The drive will operate without hard errors when subjected to the swept sine vibration of 1.0 G peak from 5
to 300 hz in the x- and y direction. For input in the z-direction, an input of 1.0 G peak amplitude can be
applied from 5 hz to 250 hz, the amplitude at 300 hz is 0.5 G peak. Linear interpolation is used to deter-
mine the acceleration levels between 250 hz and 300 hz.
The test will consist of a sweep from 5 to 300 hz and back to 5 hz. The sweep rate will be one hz per
second.
Note: 1.0 G acceleration at 5 hz requires 0.78 inch double amplitude displacement.
(The connector on the right edge does not represent SSA connector)
Figure 24. Ultrastar XP SSA Drive Small Form Factor Assembly —CxC Models
7.2.3.1 Nonoperating Vibration
No damage will occur as long as vibration at the un-packaged drive in all three directions defined above does
not exceed the levels defined in the table below. The test will consist of a sweep from 5 hz to 200 hz and
back to 5 hz at a sweep rate of eight decades per hour.
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Table 17. Non-operating Vibration Levels
Frequency
Amplitude
5 hz to 7 hz
0.8 inch DA
7 hz to 200 hz
2.0 G peak
7.2.4 Operating Shock
No permanent damage will occur to the drive when subjected to a 10 G half sine wave shock pulse of
11 milliseconds duration.
No permanent damage will occur to the drive when subjected to a 10 G half sine wave shock pulse of
2 millisecond duration.
The shock pulses are applied in either direction in each of three mutually perpendicular axis, one axis at a
time.
7.2.5 Nonoperating Shock
Translational Shock
No damage will occur if the un-packaged drive is not subjected to a square wave shock greater than a
"faired" value of 35 Gs applied to all three axis for a period of 20 milliseconds, one direction at a time.
No damage will occur if the un-packaged drive is not subjected to an 11 millisecond half sine wave shock
greater than 70 Gs applied to all three axis, one direction at a time.
No damage will occur if the un-packaged drive is not subjected to a 2 millisecond half sine wave shock
greater than 125 Gs applied to all three axis, one direction at a time.
Rotational Shock
No damage will occur if the un-packaged drive is not subjected to an 11 millisecond half sine wave shock
greater than 7,000 radians per second squared applied to all three axis, one direction at a time.
No damage will occur if the unpackaged drive is not subjected to a 2 millisecond half sine wave shock
greater than 15,000 radians per second squared applied to all three axis, one direction at a time.
7.3 Contaminants
The corrosive gas concentration expected to be typically encountered is Subclass G1; the particulate environ-
ment is expected to be P1 of C-S 1-9700-000 (1/89).
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7.4 Acoustic Levels
Upper Limit Sound Power Requirements (Bels) for C1x & C2x Models
Octave Band Center Frequency (Hz)
A-weighted (see notes)
125
4.5
4.5
250
3.5
4.0
500
3.3
3.6
1K
3.5
4.1
2K
4.5
4.8
4K
4.5
4.8
8K
4.5
4.5
Maximum
5.00
Mean
4.7
Idle
Operating
5.25
5.0
Additionally, the population average of the sound pressure measured one meter above the center of the drive
in idle mode will not exceed 36 dB.
Upper Limit Sound Power Requirements (Bels) for C4x Models
Octave Band Center Frequency (Hz)
A-weighted (see notes)
125
4.6
4.6
250
3.5
4.0
500
3.3
3.6
1K
3.5
4.1
2K
4.5
5.1
4K
4.8
4.8
8K
4.8
4.8
Maximum
Mean
4.7
Idle
5.0
5.3
Operating
5.0
Additionally, the population average of the sound pressure measured one meter above the center of the drive
in idle mode will not exceed 41 dBA.
Notes:
1. The above octave band and maximum sound power levels are statistical upper limits of the sound
power levels. See C-B 1-1710-027 and C-S 1-1710-006 for further explanation.
2. The drive's are tested after a minimum of 20 minutes warm-up in idle mode.
3. The operating mode is simulated by seeking at a rate between 28 and 32 seeks per second.
4. The mean of a sample size of 10 or greater will be less than or equal to the stated mean with
95% confidence.
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8.0 Standards
8.1 Safety
UNDERWRITERS LABORATORY (UL) APPROVAL:
The product is approved as a Recognized Component for use in Information Technology Equipment
according to UL 1950 (without any Code 3 deviations). The UL Recognized Component marking is
located on the product.
CANADIAN STANDARDS ASSOCIATION (CSA) APPROVAL:
The product is certified to CAN/CSA-C22.2 No. 950-M89 (without any D3 deviations). The CSA
certification mark is located on the product.
INTERNATIONAL ELECTROTECHNICAL COMMISSION (IEC) STANDARDS
The product is certified to comply to EN60950 (IEC 950 with European additions) by TUV Rheinland.
The TUV Rheinland Bauart mark is located on the product.
SAFE HANDLING:
The product is conditioned for safe handling in regards to sharp edges and corners.
ENVIRONMENT:
IBM will not knowingly or intentionally ship any units which during normal intended use or foreseeable
misuse, would expose the user to toxic, carcinogenic, or otherwise hazardous substances at levels above
the limitations identified in the current publications of the organizations listed below.
International Agency for Research on Cancer (IARC)
National Toxicology Program (NTP)
Occupational Safety and Health Administration (OSHA)
American Conference of Governmental Industrial Hygienists (ACGIH)
California Governor's List of Chemical Restricted under California Safe Drinking Water and Toxic
Enforcement Act 1986 (also known as California Proposition 65)
SECONDARY CIRCUIT PROTECTION REQUIRED IN USING SYSTEMS
IBM has exercised care not to use any unprotected components or constructions that are particularly
likely to cause fire. However, adequate secondary overcurrent protection is the responsibility of the user
of the product. Additional protection against the possibility of sustained combustion due to circuit or
component failure may need to be implemented by the user with circuitry external to the product. Over-
current limit to the drive of 10 Amps or less should provide sufficient protection.
8.2 Electromagnetic Compatibility (EMC)
FCC Requirements
Pertaining to the disk drive, IBM will provide technical support to assist users in complying with the
United States Federal Communications Commission (FCC) Rules and Regulations, Part 15, Subpart J
Computing Devices “Class A and B Limits”. Tests for conformance to this requirement are performed
with the disk drive mounted in the using system.
VDE Requirements
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Pertaining to the disk drive, IBM will provide technical support to assist users in complying with the
requirements of the German Vereingung Deutcher Elektriker (VDE) 0871/6.78, both the Individual
Operation Permit (IOP) and the General Operation Permit (GOP) Limits.
CSPR Requirements
Pertaining to the disk drive, IBM will provide technical support to assist users in complying with the
Comite International Special des Perturbations Radio Electriques (International Special Committee on
Radio Interference) CISPR 22 “Class A and B Limits”.
European Declaration of Conformity
Pertaining to the disk drive, IBM will provide technical support to assist users in complying with the
European Council Directive 89/336/ECC so the final product can thereby bear the “CE” Mark of Con-
formity.
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Bibliography
1. Serial Storage Architecture SSA-PH (Transport
Layer), X3T10.1/989-D_rev_01, January 19th,
1994, Editor: John Scheible.
4. Serial Storage Architecture SSA-SCSI-2 Protocol,
UIG/95SP-9508_Revision_1, May 25th, 1995,
Editor: Norman Apperley.
2. Serial Storage Architecture SSA-SCSI (SCSI-2
Mapping), SSA-UIG/93-036_rev_01, January 20th,
1994, Editor: John Scheible.
5. Ultrastar XP (DFHC) SSA Models Interface Spec-
ification, AZ09-0100-04E, February 20th, 1995.
6. Ultrastar XP (DFHC) SSA Models Produc Hard-
ware Specification, RZ09-0104-04E, Jan 1 st 1994.
3. Serial Storage Architecture SSA-PH (Transport
Layer), UIG95PH-9509_Revision_1, June 19th,
1995, Editor: Adge Hawes.
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